首页> 外文会议>Electron Devices Meeting, 2002. IEDM '02. Digest. International >Investigation of realistic dopant fluctuation induced device characteristics variation for sub-100 nm CMOS by using atomistic 3D process/device simulator
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Investigation of realistic dopant fluctuation induced device characteristics variation for sub-100 nm CMOS by using atomistic 3D process/device simulator

机译:使用原子3D工艺/器件仿真器研究低于100 nm CMOS的实际掺杂剂波动引起的器件特性变化

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We have investigated device characteristics fluctuations of deep sub-100 nm CMOS devices induced by the statistical nature of the number and position of discrete dopant atoms by using newly developed three dimensional atomistic device simulator coupled with realistic atomistic process simulator. The gate length dependence of threshold voltage and drain current fluctuations for both p- and n-MOSFETs has been calculated. Coupling of the atomistic process and device simulations enables us to perform sensitivity analysis of the threshold voltage fluctuation in terms of independent dopant contribution, such as that of the dopant in the source/drain or channel region.
机译:我们通过使用新开发的三维原子器件仿真器和现实原子过程仿真器,研究了由离散掺杂原子数量和位置的统计性质引起的深亚100 nm CMOS器件的器件特性波动。已经计算出p型和n型MOSFET的阈值电压和漏极电流波动的栅极长度依赖性。原子过程和器件仿真的耦合使我们能够根据独立的掺杂物贡献(例如源/漏或沟道区中掺杂物的贡献)对阈值电压波动进行灵敏度分析。

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