The SLI business embraces inherent problems in relationt o silicon proces and design implementation. As the technology becomes more complex and geometries become smaller, shortening TAT and reducing costs become vever more urgent and significant tasks. Efforts are currently being made, particularly in the field of compilable total solutions, to shorten TAT and to re-use modules so as to reduce costs. in the trend towards smaller geometries, TAT and costs related to the mask process (including MDP) are becoming significant factors. It is necessary to optimize the entire process from design to MDP (including OPC and PSM), mask-making and lithography and thereby improve pattern precision, reduce EB writer shots, achieve greater mask latitude and identify true defects. It will also be necessary to re-use the lithography model during MDP and to use a consistent data hierarchy and a consistent data format.
展开▼
