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Lithography Performance of Contact Holes-Part I. Optimization of Pattern Fidelity Using MPG and MPG-II

机译:接触孔的光刻性能-第一部分。使用MPG和MPG-II优化图案保真度

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Proximity effects make optimizing the pattern fiedlity of contact holes one of the most challenging lithographic tasks in maskmaking. This paper examines the exposure and process parameters that influence the pattern fidelity of contact holes on a photomask from both a modeling and an experimental approach. To optimize contact critical dimension (CD) uniformity and corner rounding, a rnage of exposure and process variables is examined. These variables include MEBES~circleR writing strategy (which is multipass gray, also known as MPG, and MPG-II), input address, spot size, development time, and data bias. ProBEAM/3D, an electron-beam (e-beam) modeling software program, is used to model contact hole performance, and the results are verified with a design of experiments protocol using the same variables as in the simulation study. A simultaneous optimization of these parameters is instructive in matching the appropriate writing strategy and technology node with the desired quality of the contact hole.
机译:邻近效应使优化接触孔的图案保真度成为掩模制造中最具挑战性的光刻任务之一。本文通过建模和实验方法研究了影响光掩模上接触孔图案保真度的曝光和工艺参数。为了优化接触临界尺寸(CD)的均匀性和圆角修整,需要检查暴露量和工艺变量。这些变量包括MEBES_circleR写入策略(多通灰色,也称为MPG和MPG-II),输入地址,光斑大小,显影时间和数据偏差。 ProBEAM / 3D是一种电子束(e-beam)建模软件程序,用于对接触孔性能进行建模,并通过使用与模拟研究中相同的变量的实验方案设计来验证结果。这些参数的同时优化对于将适当的写入策略和技术节点与所需的接触孔质量进行匹配具有指导意义。

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