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X-ray diffraction determination of texture and stress in damascene fabricated copper interconnects

机译:X射线衍射法测定镶嵌制造的铜互连中的织构和应力

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X-Ray diffraction (XRD) provides an excellent tool for the measurement of both stress and texture (preferred orientation) on fabricated damascene interconnect structures. Since x-ray diffraction provides a direct measurement of lattice spacings, film strain can be measured directly. Also, since the intensity of diffracted x-rays is proportional to the density of lattice planes oriented in diffracting condition with respect to the incident heam, both the direction and extent of preferred orientation can be accurately measured. Special techniques and considerations are necessary when examining damascene interconnect structures with XRD which are not necessary with blanket films. These techniques are discussed and described in order to aid in obtaining meaningful XRD data and a correct interpretation of the results.
机译:X射线衍射(XRD)为测量镶嵌互连结构上的应力和纹理(首选方向)提供了出色的工具。由于X射线衍射可直接测量晶格间距,因此可以直接测量薄膜应变。另外,由于衍射X射线的强度与相对于入射光束在衍射条件下取向的晶格面的密度成正比,因此可以准确地测定优选取向的方向和程度。当使用XRD检查镶嵌互连结构时,需要特殊的技术和考虑因素,而毯覆膜则不需要。讨论和描述了这些技术,以帮助获得有意义的XRD数据和对结果的正确解释。

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