首页> 外文会议>High Performance Electron Devices for Microwave and Optoelectronic Applications, 1999. EDMO. 1999 Symposium on >Characterisation of NPN and PNP SiGe heterojunction bipolar transistors formed by Ge/sup +/ implantation
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Characterisation of NPN and PNP SiGe heterojunction bipolar transistors formed by Ge/sup +/ implantation

机译:通过Ge / sup + /注入形成的NPN和PNP SiGe异质结双极晶体管的特性

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This work compares NPN and PNP SiGe HBTs fabricated simultaneously using Ge/sup +/ implantation in the base to achieve an average Ge concentration of 4 at.%. Electrical measurements are presented and discussed with TEM and SIMS analysis. The results show that the PNP HBTs give superior performance to the NPNs, as they have more ideal collector characteristics. The NPN HBTs exhibit collector-emitter leakage. Both types of Ge/sup +/ implanted device have non-ideal base currents. TEM images show that both NPN and PNP devices have a high density of defects in the Ge/sup +/ implanted area. The electrical results are explained by the opposing effect of the Ge/sup +/ implant on the diffusion coefficients of boron and arsenic, as seen in the SIMS profiles. The increased emitter diffusion in the NPN HBTs creates a narrower base region, which is more prone to collector-emitter leakage. The hairpin dislocations in the base are thought to be the cause of the base current ideality deterioration.
机译:这项工作比较了在基体中使用Ge / sup + /注入同时制造的NPN和PNP SiGe HBT,以使平均Ge浓度达到4 at。%。借助TEM和SIMS分析介绍和讨论电气测量。结果表明,由于PNP HBT具有更理想的集电极特性,它们使NPN具有更好的性能。 NPN HBT表现出集电极-发射极泄漏。两种类型的Ge / sup + /植入器件都具有不理想的基极电流。 TEM图像表明,NPN和PNP器件在Ge / sup + /注入区域均具有高密度的缺陷。如SIMS曲线所示,Ge / sup + /注入对硼和砷扩散系数的相反影响可以解释电学结果。 NPN HBT中发射极扩散的增加​​会导致基极区变窄,从而更容易发生集电极-发射极泄漏。基极中的发夹型位错被认为是基极电流理想性下降的原因。

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