Stress analysis on the open window plastic package for sensors

摘要

Sensor packaging has become a critical element of a competitive sensor industry, being determinant of sensor performance and cost. Our recent work was foucused on a new pakcaging concept, the open window conept that alows the phenomenon to gbe measured to reach freely the sensor active area, withou impeding on the sealing of the circuit. The open window concept provides low cost packaging solutions by simple customization of standard pastic packages that can consequantly be used for a wode range of sensors.