Additive electroplating technology as a new integration concept for MEMS

摘要

This paper reports on a new integration concept for MEMS based on an Additive Electroplating Technology (AET). This technology allows the integration of fixed and movable electroplated microstructure on top of a standard ASIC by a low temperature back-end process. The basic fabrication sequence of the AET including aspects of a first level packaging will be presented. Various examples of novel MEMS for automotive and medical applications will show the capability and the limitations of this integration concept.