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A Hybrid Fuzzy Decision Model for Evaluating MEMS and IC Integration Technologies

机译:一种评估MEMS和IC集成技术的混合模糊决策模型

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摘要

Integrated devices incorporating MEMS (microelectromechanical systems) with IC (integrated circuit) components have been becoming increasingly important in the era of IoT (Internet of Things). In this study, a hybrid fuzzy MCDM (multi-criteria decision making) model was proposed to effectively evaluate alternative technologies that incorporate MEMS with IC components. This model, composed of the fuzzy AHP (analytic hierarchy process) and fuzzy VIKOR (VIseKriterijumska Optimizacija I Kompromisno Resenje) methods, solves the decision problem of how best to rank MEMS and IC integration technologies in a fuzzy environment. The six important criteria and the major five alternative technologies associated with our research themes were explored through literature review and expert investigations. The priority weights of criteria were derived using fuzzy AHP. After that, fuzzy VIKOR was deployed to rank alternatives. The empirical results show that development schedule and manufacturing capability are the two most important criteria and 3D (three-dimensional) SiP (system-in-package) and monolithic SoC (system-on-chip) are the top two favored technologies. The proposed fuzzy decision model could serve as a reference for the future strategic evaluation and selection of MEMS and IC integration technologies.
机译:包含MEMS(微机电系统)的集成器件与IC(集成电路)组件在物联网(物联网)时已经变得越来越重要。在本研究中,提出了一种混合模糊MCDM(多标准决策)模型,以有效地评估与IC组件合并MEMS的替代技术。该模型由模糊AHP(分析层次处理)和模糊Vikor(Visekriterijumska OptimizaCija I Kompromisno Resenje)方法组成,解决了如何最好地在模糊环境中排名MEMS和IC集成技术的决策问题。通过文献综述和专家调查探讨了与我们的研究主题相关的六个重要标准和主要的五项替代技术。使用模糊AHP导出标准的优先权重。之后,模糊Vikor部署到排名替代品。经验结果表明,发展计划和制造能力是最重要的两个最重要的标准和3D(三维)SIP(封装系统)和单片SOC(片上系统)是顶级有利的技术。所提出的模糊决策模型可以作为未来战略评估和选择MEMS和IC集成技术的参考。

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