首页> 外文会议>Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International >Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET
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Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET

机译:电压缩放和温度对热载流子应力n-MOSFET中漏极泄漏电流退化的影响

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Drain leakage current degradation at zero V/sub gs/ in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. The results show that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.
机译:测量并建模耗尽在零v / sub gs / round载体中的漏电电流劣化。漏极漏电流对电源电压和温度的依赖性的特征在于。在建模中,考虑各种排水泄漏电流机构,包括漏电源亚阈值漏电流,带状带隧道电流和接口陷阱辅助漏电流。结果表明,界面陷阱诱导漏电流似乎是主要的漏极泄漏机构,因为电源电压缩放3.0 V.由于热载体应力,已经观察到耗费级的损耗电流降低。

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