首页> 外文会议>Indium Phosphide and Related Materials, 1998 International Conference on >Low-power operation of InP-based DHBT's for high bit rate circuit applications: reduction of saturation voltage (V/sub sat/)
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Low-power operation of InP-based DHBT's for high bit rate circuit applications: reduction of saturation voltage (V/sub sat/)

机译:基于InP的DHBT在高比特率电路应用中的低功耗工作:降低饱和电压(V / sub sat /)

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An important doping level of quaternary layers and a thin collector thickness is experimentally shown to improve electron transport properties in base-collector junction of InP/InGaAs/InGaAsP Double Heterojunction Bipolar Transistors (DHBTs) and also to yield a small saturation voltage (V/sub sat/). We have fabricated InP/InGaAs/InGaAsP-InP DHBT's with very low Vsat (0.8 V) by increasing the grading layers doping level (5.10/sup 16/ cm/sup -3/), optimizing the spacer layer thickness (30 nm) and reducing both the collector area and thickness (350 nm). This latter characteristic was compensated for in terms of base-collector capacitance (C/sub BC/) by a collector area reduction (over-etching). Those optimizations do not induce any degradation of static and dynamic transistor performances: static gain=78, BVce=9 V, F/sub t/=80 GHz and F/sub max/=60 GHz for a DHBT with emitter-base area S/sub EB/=4/spl times/11 /spl mu/m/sup 2/.
机译:实验表明,重要的四元层掺杂水平和薄的集电极厚度可改善InP / InGaAs / InGaAsP双异质结双极晶体管(DHBT)的基极-集电极结中的电子传输性能,并产生较小的饱和电压(V / sub坐/)。我们通过增加渐变层的掺杂水平(5.10 / sup 16 / cm / sup -3 /),优化间隔层厚度(30 nm)并制造了具有非常低Vsat(0.8 V)的InP / InGaAs / InGaAsP-InP DHBT,减少集电极面积和厚度(350 nm)。后一种特性在基极-集电极电容(C / sub BC /)方面通过减小集电极面积(过度蚀刻)得到了补偿。这些优化不会引起静态和动态晶体管性能的任何下降:对于发射极-基极面积为S的DHBT,静态增益= 78,BVce = 9 V,F / sub t / = 80 GHz和F / sub max / = 60 GHz / sub EB / = 4 / spl times / 11 / spl mu / m / sup 2 /。

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