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Correlation between defects, residual strain and morphology in continuously graded InGaAs/GaAs buffers

机译:连续分级IngaAs / GaAs缓冲液中缺陷,残留应变和形态的相关性

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The influence of different types of grading (linear, parabolic and square-root) and growth conditions on residual strain, Threading Dislocation (TD) density, Misfit Dislocation (MD) confinement and surface morphology of MBE grown InGaAs/GaAs buffer layers has been studied by TEM, RBS, SIMS and AFM techniques. Non-linear buffers have wider MD-free surface regions and higher MD concentrations near the substrate where the compositional gradients are higher. Lowering the growth temperature and using an As_2 beam leads to symmetric and smoother cross-hatch morphology and removes asymmetries in the residual strain.
机译:研究了不同类型分级(线性,抛物线和方毒根)和生长条件对残留应变,穿线脱位(Td)密度,MBE成长Ingaas / GaAs缓冲层的矛盾(MD)限制和表面形态的影响通过TEM,RB,SIM卡和AFM技术。非线性缓冲剂具有更宽的无MD表面区域和较高的MD浓度,靠近组成梯度更高的基材。降低生长温度并使用AS_2光束导致对称和更平滑的交叉舱口形态,并在残留菌株中除去不对称。

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