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MEMS infrastructure: the multiuser MEMS processes (MUMPs)

机译:MEMS基础设施:多用户MEMS工艺(MUMP)

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Abstract: In order to help provide access to advanced MEMS technologies, and lower the barriers for both industry and academia, MCNC, and ARPA have developed a program which works to provide users with access to both MEMS processes and advanced integration techniques. The two distinct aspects of this program, the MUMPs and Smart MEMS, will be described in this paper. The multi-user MEMS processes (MUMPs) is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. MUMPs is a proof-of-concept and educational tool to aid the developemnt of MEMS in the domestic community. MUMPs technologies currently include a 3-layer polysilicon surface micromachining process and LIGA processes that provide reasonable design flexibility within set guidelines. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. !6
机译:摘要:为了帮助提供对先进MEMS技术的访问权限,并降低行业和学术界的壁垒,MCNC和ARPA开发了一个程序,旨在为用户提供对MEMS工艺和先进集成技术的访问权限。本文将介绍该程序的两个不同方面,即MUMP和Smart MEMS。多用户MEMS工艺(MUMP)是ARPA支持的程序,旨在在多用户环境中提供对MEMS技术的廉价访问。 MUMP是一种概念证明和教育工具,可帮助MEMS在国内社区的发展。 MUMPs技术目前包括3层多晶硅表面微加工工艺和LIGA工艺,这些工艺可在既定准则内提供合理的设计灵活性。智能MEMS是通过倒装芯片技术的应用而开发的,用于MEMS的先进电子集成技术。 !6

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