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Micromachined sensor and actuator research at the Microelectronics Development Laboratory

机译:微电子开发实验室的微机械传感器和执行器研究

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Abstract: An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories will be presented. Development efforts are under way for a variety of micromechanical devices and control electronics for those devices. Surface micromachining is the predominant technology under development. Pressure sensors based on silicon nitride diaphragms have been developed. Hot polysilicon filaments for calorimetric gas sensing have been developed. Accelerometers based upon high-aspect ratio surface micromachining are under development. Actuation mechanisms employing either electrostatic or steam power are being combined with a three-level active (plus an additional passive level) polysilicon surface micromachining process to couple these actuators to external devices. The results of efforts toward integration of micromechanics with the driving electronics for actuators or the amplification/signal processing electronics for sensors is also described. This effort includes a tungsten metallization process to allow the CMOS electronics to withstand high-temperature micromechanical processing.!8
机译:摘要:将介绍使用桑迪亚国家实验室微电子开发实验室的微加工功能进行的主要传感器和执行器项目的概述。各种微机械设备和用于这些设备的控制电子设备的开发工作正在进行中。表面微加工是正在开发的主要技术。已经开发了基于氮化硅膜片的压力传感器。已经开发出用于量热气体感测的热多晶硅丝。基于高长宽比表面微加工的加速度计正在开发中。采用静电或蒸汽动力的致动机构与三级有源(加上附加的无源级)多晶硅表面微加工工艺相结合,以将这些致动器耦合到外部设备。还描述了将微机械与致动器的驱动电子装置或传感器的放大/信号处理电子装置集成在一起的结果。这项工作包括钨金属化工艺,以使CMOS电子器件能够承受高温微机械加工。!8

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