首页> 外文会议>Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on >Microwave performance of InP-based HEMTs for low voltage application fabricated by optical lithography
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Microwave performance of InP-based HEMTs for low voltage application fabricated by optical lithography

机译:光刻技术制备的基于InP的HEMT在低压应用中的微波性能

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The low voltage high frequency performance of InP-based HEMTs is examined. All the devices are fabricated by simple optical lithography resulting in gate length /spl ges/0.5 /spl mu/m. The RF results of the structures discussed show that uncompromised small RF performance of InP based FETs can be obtained in the low drain bias range below 2 V. Even for moderate gate lengths of 0.5 /spl mu/m, operation down to Vd=1 V seems feasible. The highest cut-off frequencies extrapolated are f/sub t/=60 GHz and f/sub max/=160 GHz at Vd=1.6 V. This represents an ft*Lg-product of 39 GHz/spl mu/m and a f/sub max//f/sub t/ of 2.6 at the identical gate and drain bias point. This indicates that high power gain is possible at high overshoot velocity. Three different material structures have been analysed. The drift-region analysis indicate that an optimum design is a structure with high open channel current density realised with high carrier concentration.
机译:研究了基于InP的HEMT的低压高频性能。所有器件都是通过简单的光刻工艺制造的,其栅极长度为/ spl ges / 0.5 / spl mu / m。所讨论结构的RF结果表明,在2 V以下的低漏极偏置范围内,可以获得基于InP的FET毫不妥协的小RF性能。即使对于0.5 / spl mu / m的中等栅极长度,其工作电压低至Vd = 1 V似乎可行。在Vd = 1.6 V时推断出的最高截止频率为f / sub t / = 60 GHz和f / sub max / = 160 GHz。这表示ft * Lg乘积为39 GHz / spl mu / m和af /在相同的栅极和漏极偏置点处的sub max // f / sub t /为2.6。这表明在高过冲速度下可能获得高功率增益。已经分析了三种不同的材料结构。漂移区分析表明,最佳设计是在高载流子浓度下实现高开路电流密度的结构。

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