Adhesive flip chip bonding in a miniaturised spectrometer

摘要

This paper discusses the selection of a suitable isotropicallyconductive adhesive for flip chip bonding of a micromachined component.The adhesive must have adequate electrical conductivity and mechanicalbonding strength. Most commercial adhesives possess these qualities. Inaddition, small bumps of spherical shape need to be dispensed evenly andrepeatedly. Eight adhesives were studied and one suitable candidate wasfound. The manufacture of the spectrometers proceeded successfully. Theinterferometer was fixed on top of a silicon detector by a flip chiptechnique using an isotropically conductive adhesive. Two prototypeseries with a total of 25 spectrometers have been produced, and 23 ofthem passed operational testing