The author examines three different aspects of exploiting a structure's symmetry to efficiently compute electrical packaging parameters: (a) recognizing the cross-sectional symmetry eases the numerical integration of 3-D partial inductances; (b) the direct inversion of a partial impedance matrix lets one take advantage of a structure's symmetry in computing resistance and inductance matrices of uniformly coupled transmission lines; and (c) an almost symmetric and/or periodic structure can be either decomposed or augmented to exploit the special property of its corresponding system matrix.
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