Package requirements for high performance VLSI CMOS chips

摘要

There is a set of unique characteristics that can make the choice of package attributes even more critical for CMOS than when designing with a bipolar or GaAs technology. The CMOS packaging concerns are caused by features that make it a desirable technology choice for high performance systems. They are: switching speed, high density, and no DC power. These items can drive the need for a package definition that requires all of the complexity and cost of the kinds of packaging normally thought of for mainframes and supercomputers.