A multichip module designed specifically to meet the demands of high-performance processor array systems has been developed. The system consists of computer-generated holograms, GaAs laser array chips, and detectors integrated onto silicon integrated circuits. All components are incorporated into a package (similar to an existing multichip module design) with a water-cooled heat sink. All intramodule chip-chip connections longer than a particular line length and all intermodule connections are implemented optically. The prototype module will have 54 optical links, composed of 33 one-to-one connections of various lengths and angles and 21 connections with fanouts ranging from two to three. These various connections will allow the experimental determination of cross-talk, signal-to-noise ratio, alignment sensitivity, and efficiency of the optical links. Comparisons with guided wave optical interconnects and electrical interconnects are made.
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