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Low-temperature die attach material

机译:低温芯片贴装材料

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摘要

Describes the development of glasses for silver glass die attach application at temperature below 400 degrees and as low as 260 degrees C. It is observed that the basic principle of the nonbridging oxygen formulation mechanism can be used to design glasses in the development of new silver glass composites. These new composites were shown to perform at lower application temperatures with similar or better reliability than the original lead borate glass based silver composite. It was demonstrated that glass composition, glass transition temperature, and glass crystallization behavior were key to the ultimate performance of the composite.
机译:描述了用于在低于400度且低至260摄氏度的温度下进行银玻璃管芯附着的玻璃的开发。已观察到,非桥联氧配制机理的基本原理可用于设计新型银玻璃中的玻璃复合材料。与基于硼酸铅玻璃的原始银复合材料相比,这些新型复合材料在较低的应用温度下具有相似或更好的可靠性。结果表明,玻璃的组成,玻璃化转变温度和玻璃的结晶行为是复合材料最终性能的关键。

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