A readily pretestable, reworkable MCM

摘要

An MCM (multichip module) architecture that could permit the assembly of low-cost, high-performance modules based on the existing manufacturing infrastructure is described, and results from an initial investigation of a few key issues are reported. How the adoption of DTAB (demountable tape automated bonding) technology for the chip-substrate interconnect enables fully tested and burned-in chips to be delivered to module assembly without invoking major changes in the IC manufacturing strategy is discussed. The question of how initial assembly and rework can be accomplished simply with DTAB and the FIM (flexible interconnect module) architecture is addressed. The flexibility in choice of substrate used is discussed, and it is indicated how the performance potential inherent to this architecture is more than sufficient for future workstation applications, both electrically and thermally. Module-motherboard mounting and mechanical support are discussed. This technology strategy could result in the attainment of computer system performance levels which are achievable only with the highest-performance MCMs, within a packaging cost profile acceptable for the highly competitive workstation business.