首页> 外文会议>Indium Phosphide and Related Materials, 1991., Third International Conference. >A 1.3 mu m InGaAsP ridge waveguide laser on GaAs and silicon substrates thin-film transfer
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A 1.3 mu m InGaAsP ridge waveguide laser on GaAs and silicon substrates thin-film transfer

机译:在GaAs和硅衬底上的1.3微米InGaAsP脊形波导激光器的薄膜转移

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A technique that makes it possible to transfer semiconductor epitaxial films from a lattice-matched growth substrate to a host substrate of a different material is discussed. The transfer of epitaxial films allows materials with different lattice constants to be bonded together without generating a substantial number of defects in regions that are critical to device operation. The thin-film transfer process utilizes metallic solder as an interface between the transferred semiconductor layers and the host substrate. In this transfer process. the film is rigidly supported at all times during transfer, providing the potential for defect-free large-area films. The fabrication of InGaAsP lasers on both GaAs and Si substrates is described. Measurements of the optical characteristics of the lasers show threshold currents comparable to those of conventional lasers.
机译:讨论了一种技术,该技术可使半导体外延膜从晶格匹配的生长衬底转移到另一种材料的主体衬底。外延膜的转移允许具有不同晶格常数的材料结合在一起,而不会在对器件操作至关重要的区域中产生大量缺陷。薄膜转移工艺利用金属焊料作为转移的半导体层和主体基板之间的界面。在这个转移过程中。在转移过程中,薄膜始终受到刚性支撑,为无缺陷的大面积薄膜提供了潜力。描述了在GaAs和Si衬底上InGaAsP激光器的制造。激光器的光学特性的测量结果显示了与常规激光器相当的阈值电流。

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