Solder interconnections for SMT selective line coupling

摘要

Prior to the solder interconnect technology (SIT), the mode of operation for single-in-line memory module (SIMM) build was to design one printed-circuit card for each assembly build. Solder interconnection is designed to reduce the number of printed-circuit card designs. They are beneficial to applications requiring multiplex signal lines and are produced by unique solder-mask designs and personalized by use of surface-mount-technology (SMT) process. The masks are designed in conjunction with solder interconnects on card surfaces and, with assigned apertures, allow solder to be applied on selected connections. While solder interconnect allows flexibility, its design is critical in order to ensure high reliability, manufacturability, and proper electrical parameters. Hardware has been qualified, manufactured, and tested for these attributes in an SMT process.