Molded Interconnect Substrate (MIS) Technology for Semiconductor Packages

摘要

This paper provides a comprehensive treatment on the performance characteristics of Molded Interconnect Substrate (MIS) technology, which has been deemed a highly effective solution to small and reliable semiconductor packages tailored for applications including but not limited to Power Management, RF Frontend, Edge-AI/Computing, and Automotive. This paper is organized as follows: Upon Introduction, a practical treatment on key performance characteristics of MIS technology is provided. The respective processes of implementing one-layer and multiple-layer MIS package designs are described, and the corresponding challenges and performance/cost implications are presented. After that, production-proven package examples implemented with MIS technology are reported, demonstrating the versatility of this semiconductor technology. The last section of this paper explores potential usages of MIS technology for, e.g. Package-on-Package.