Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

摘要

Fan-out wafer level package (FO-WLP) technology provides an ideal approach for millimeter-wave (mm-Wave) chip with higher I/O density, excellent electrical performance and greater design flexibilities. In this paper, a package with the size of 9.46mm×9.77mm for 77GHz automotive radar chip with size of 5.89mm×5.83mm is developed by embedded glass fan out (eGFO) technology. And then a high electrical performance solution for antenna-in-package (AiP) is demonstrated. A number of antennas are designed and fabricated on the top of the package using redistribution layer (RDL). The eGFO package with antennas has a size of 23.1mm×10.7mm with 220μm thin body thickness and a footprint with a standard ball pitch of 0.5mm. There are antenna arrays for receiver and transmitter which are distributed on the same plane of the chip surface and located on two sides of the chip. The ground plane on the top of the printed circuit board (PCB) is used as a reflector for the integrated antenna. Simulation results show that present eGFO can provide a high electrical performance solution for automotive radar packaging with AiP.