Composite feedforward - fuzzy PID control based on IC package for Wafer Level Flip-chip Equipment Motion Platform

摘要

In the process of rapid development of semi- conductor industry, IC packaging equipment requires high precision and speed of motion platform. Motion platform with high acceleration and high precision plays a key role in precise positioning of wafer level flip-chip equipment. Composite in this paper, speed, acceleration and jerk feedforward control and fuzzy PID control method, compared with the traditional PID control can improve motion platform speed and precision of location, and diminish shock and vibration of mechanical components caused by high acceleration and jerk. Quartic polynomial type speed planning algorithm based on S-shaped curve is proposed, which makes acceleration and deceleration smooth and fast. The simulation experimental results show that the proposed method can effectively reduce the adjustment time, reduce the overshooting of the tracking, respond quickly, and meet the performance requirements of moving platform on the microelectronic packaging equipment.