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A Novel High Voltage SOI LIGBT with Split Gate and Carrier Stored Layer

机译:具有分栅和载流子存储层的新型高压SOI LIGBT

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A novel high voltage silicon-on-insulator (SOI) based lateral insulated gate bipolar transistor (LIGBT) with a split gate (SG) and an N-type carrier stored (N-CS) layer (SOI SGCS-LIGBT) is proposed. The shielding effect provided by the trench SG structure reduces the Miller capacitance (CGC) of the device. Meanwhile, the trench structure as well as the N-CS layer both work as a hole barrier to enhance the conduction modulation in the emitter side of the N- drift region. Numerical analysis results show that the QG for the VGE increases from 0V to 10V and the CGC at the VCE=25V are deceased from 0.27μC/cm2 and 0.54nF/cm2 of the conventional enhanced trench gate LIGBT (ET-LIGBT) to 0.11μC/cm2 and 0.08nF/cm2 of the proposed structure, respectively. Meanwhile, compared with the ET-LIGBT, the turn-off loss (EOFF) of the proposed SGCS-LIGBT is reduced by 44.4% at the same on-state voltage drop (VCEON) of 2.0V.
机译:提出了一种新颖的基于高压绝缘体上硅(SOI)的横向绝缘栅双极晶体管(LIGBT),其具有分离栅(SG)和N型载流子存储(N-CS)层(SOI SGCS-LIGBT)。沟槽SG结构提供的屏蔽效果降低了米勒电容(C GC )的设备。同时,沟槽结构以及N-CS层均用作空穴阻挡层,以增强N-漂移区的发射极侧的传导调制。数值分析结果表明 G VGE从0V增加到10V,而C GC 在V CE 从0.27μC/ cm减小= 25V 2 和0.54nF / cm 2 常规增强型沟槽栅LIGBT(ET-LIGBT)的精度达到0.11μC/ cm 2 和0.08nF / cm 2 拟议的结构分别。同时,与ET-LIGBT相比,建议的SGCS-LIGBT的关断损耗(EOFF)在2.0V的相同导通电压降(VCEON)下降低了44.4%。

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