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Low On-state Voltage and Latch-up Immunity Thin SOI LIGBT with Multi-Segmented Trench Gates

机译:低导通电压和闩锁抗扰性具有多段沟槽栅极的薄型SOI LIGBT

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A novel thin SOI lateral insulated gate bipolar transistor (LIGBT) with low on-state voltage drop ( Von) and latch-up immunity is proposed. The device features the multi-segmented trench gates in the z-direction, named MST LIGBT. The multi-segmented gates form multi conduction channels along the sidewalls, which increases the channel density so as to reduce Von and increase saturation current. Furthermore, the multi-segmented gates hinder the holes from being extracted by the cathode in the x- and z- direction, which attracts a large number of electrons injected from the cathode, and therefore the conduction modulation effect is enhanced. The Von of MST LIGBT reduces by 34.8% and 27.6% in comparison with those of the conventional (Con). LIGBT and the tridimensional channel (TC) LIGBT. In addition, the short circuit time of MST LIGBT increases to 1.92 μs in comparison with 1.73 μs of the Con. LIGBT and 1.81 μs of the TC LIGBT, owing to the smallest shorted cathode resistance ( RSC).
机译:提出了一种新型的薄型SOI横向绝缘栅双极晶体管(LIGBT),具有低的导通状态压降(Von)和抗闩锁性。该器件具有z方向上的多段沟槽栅极,称为MST LIGBT。多段栅极沿着侧壁形成多条导电通道,从而增加了通道密度,从而降低了Von并增加了饱和电流。此外,多段栅极阻碍了空穴在x和z方向上被阴极引出,从而吸引了大量从阴极注入的电子,因此提高了传导调制效果。与常规(Con)相比,MST LIGBT的Von分别降低了34.8%和27.6%。 LIGBT和三维通道(TC)LIGBT。另外,与Con的1.73μs相比,MST LIGBT的短路时间增加到1.92μs。 LIGBT和TC LIGBT的1.81μs,这是由于最小的阴极阴极电阻(RSC)最小。

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