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Device Electrostatics and High Temperature Operation of Oxygen Terminated Boron Doped Diamond MOS Capacitor and MOSFET

机译:端氧掺杂的硼掺杂金刚石MOS电容器和MOSFET的器件静电和高温操作

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The oxygen-terminated bulk boron doped diamond MOSFET has been designed and simulated using coupled drift-diffusion transport-poisson solver within the TCAD analysis. The diamond MOS capacitor (MOSC) performance is dictated by accumulation, depletion, and deep depletion regimes of operation. We successfully calibrate the fitting parameters in the physical models such as doping and high-field limited carrier mobility, dopant ionization energies, and energy band gap dependence on temperature with experimental C- V and transfer characteristics. We show that the threshold voltage is sensitive to high temperatures. The device exhibits reasonably good ON to OFF current ratio of 108 -104at wide temperature range from 300 K - 550 K. We also show that the device exhibits a breakdown voltage of -270 V with the chosen impact ionization coefficients.
机译:已经在TCAD分析中使用耦合的漂移-扩散输运-泊松解算器设计并模拟了氧封端的块状掺硼金刚石MOSFET。金刚石MOS电容器(MOSC)的性能取决于工作的累积,耗尽和深度耗尽机制。我们成功地在物理模型中校准了拟合参数,例如掺杂和高场限载流子迁移率,掺杂剂电离能以及能带隙对温度的依赖性以及实验C-V和转移特性。我们表明阈值电压对高温敏感。该器件的ON / OFF电流比为10 8 -10 4 在300 K-550 K的宽温度范围内。我们还表明,该器件在选定的碰撞电离系数下具有-270 V的击穿电压。

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