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An Experimental Study of Single-Phase Heat Transfer inside an Additively Fabricated Microchannel Heat Exchanger

机译:加成微通道换热器内单相传热的实验研究

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Effective system energy management and cooling solutions is critical for a range of increasingly complex systems and missions. Various industries and agencies seek technologies and design techniques to cool ultra-high heat fluxes in various applications, and thereby increase system energy efficiencies in future advanced lasers, radars and power electronics. There has been an increasing interest in exploiting the use of additive manufacturing in developing nontraditional cooling schemes to be built directly into components. This study investigates the heat transfer and pressure loss performance of additively manufactured micro-channel heat exchanger. A heat exchanger of 30 micron-sized channels was manufactured via the Direct Metal Laser Sintering (DMLS) method and tested at a range of Reynolds numbers. Same test setup and configurations have been used to test the DMLS manufactured micro-channel heat exchanger here, and the results are compared to the mini-channel heat exchanger of similar dimension but manufactured traditionally. The results have shown that although DMLS manufactured micro-channel heat exchanger yield a higher-pressure loss, it has shown significantly improved convective heat transfer compared to the mini-channel heat exchanger tested under same conditions but fabricated traditionally. It is likely that non-post processed surface of the DMLS manufactured micro-channels is the main contributor of this augmented heat transfer. Future study is needed to further understand the mechanisms behind the phenomena observed here.
机译:有效的系统能源管理和冷却解决方案对于一系列日益复杂的系统和任务至关重要。许多行业和机构寻求在各种应用中冷却超高热通量的技术和设计技术,从而提高未来先进激光器,雷达和电力电子设备的系统能效。在开发将直接内置到组件中的非传统冷却方案中,利用增材制造的使用已引起越来越多的兴趣。这项研究调查了增材制造的微通道换热器的传热和压力损失性能。通过直接金属激光烧结(DMLS)方法制造了30微米通道的热交换器,并在一系列雷诺数下进行了测试。此处已使用相同的测试设置和配置来测试DMLS制造的微通道换热器,并将结果与​​尺寸相似但传统制造的微型通道换热器进行了比较。结果表明,尽管DMLS制造的微通道换热器产生更高的压力损失,但与在相同条件下但传统上制造的小通道换热器相比,它显示出显着改善的对流换热。 DMLS制造的微通道的非后处理表面可能是这种增加的热传递的主要贡献者。需要进一步研究以进一步了解此处观察到的现象背后的机制。

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