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IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
召开年:
2019
召开地:
Las Vegas(US)
出版时间:
-
会议文集:
-
会议论文
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1.
Large Scale 3D Topology Optimization of Conjugate Heat Transfer
机译:
共轭传热的大规模3D拓扑优化
作者:
Sicheng Sun
;
Piotr Liebersbach
;
Xiaoping Qian
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
finite element analysis;
Navier-Stokes equations;
optimisation;
topology;
2.
Learning Based Mesh Generation for Thermal Simulation in Handheld Devices with Variable Power Consumption
机译:
基于学习的网格生成,用于可变功耗手持设备中的热仿真
作者:
Wen-Sheng Lo
;
Hong-Wen Chiou
;
Shih-Chieh Hsu
;
Yu-Min Lee
;
Liang-Chia Cheng
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
finite difference methods;
learning (artificial intelligence);
mesh generation;
portable instruments;
power consumption;
power engineering computing;
regression analysis;
thermal management (packaging);
3.
Investigation of Thermal Metamaterials based on Nanoporous Silicon Using Ray Tracing and Finite Element Simulations
机译:
基于纳米多孔硅的热超材料的射线追踪和有限元模拟研究
作者:
Ziqi Yu
;
Zongqing Ren
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
Boltzmann equation;
elemental semiconductors;
finite element analysis;
heat transfer;
metamaterials;
nanoporous materials;
phonon-phonon interactions;
porosity;
porous semiconductors;
ray tracing;
rectification;
silicon;
size effect;
thermal conductivity;
4.
Measurement-Based Multi-Domain Modeling of LEDs for “Industry 4.0”
机译:
用于“工业4.0”的基于测量的LED多域建模
作者:
Marton C. Bein
;
Robin Bornoff
;
Gabor Farkas
;
Lajos Gaal
;
Andras Poppe
;
Marta Rencz
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
LED lamps;
light emitting diodes;
lighting;
manufacturing processes;
production engineering computing;
5.
Impact of Electronics Over Localized Hot Spots in Multi-Chip White LED Light Engines
机译:
电子对多芯片白光LED光引擎中局部热点的影响
作者:
Ahmet Mete Muslu
;
Mehmet Arik
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
light emitting diodes;
lighting;
temperature measurement;
6.
Phosphor-Silicone Coating Thickness Dependence of the White LED Junction Temperature
机译:
白光LED结温的磷硅树脂涂层厚度依赖性
作者:
Yuanhan Chen
;
Frank Shi
会议名称:
《》
|
2019年
关键词:
LED lamps;
light emitting diodes;
phosphors;
silicon;
silicones;
thermal resistance;
7.
Pressure-Dependent Thermal Characterization of Bi-Porous Copper Structures
机译:
双多孔铜结构的压力依赖性热表征
作者:
Cheng-Hui Lin
;
Yoonjin Won
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ductility;
durability;
electrodeposition;
filled polymers;
heat sinks;
mechanical strength;
particle reinforced composites;
porous materials;
sintering;
thermal conductivity;
thermal resistance;
thermal stresses;
8.
Optimal Filler Sizes for Thermal Interface Materials
机译:
热界面材料的最佳填充尺寸
作者:
Piyas Chowdhury
;
Kamal Sikka
;
Alfred Grill
;
Dishit P. Parekh
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
crystal microstructure;
elastic moduli;
elasticity;
filled polymers;
particle size;
thermal conductivity;
viscosity;
9.
Effect of Particle Arrangement on the Effective Thermal Conductivity of Polymer Composites
机译:
颗粒排列方式对聚合物复合材料有效导热系数的影响
作者:
Debraliz Isaac Aragones
;
Aaditya Candadai
;
Rajath Kantharaj
;
Amy M. Marconnet
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cameras;
composite materials;
copper;
electronics packaging;
filled polymers;
heat conduction;
heat sinks;
particle reinforced composites;
thermal conductivity;
thermal management (packaging);
thermal resistance;
10.
Measuring Water Permeation Through EPDM Rubber Hoses
机译:
通过EPDM橡胶软管测量水渗透率
作者:
Prabjit Singh
;
Larry Palmer
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cloud computing;
cooling;
design engineering;
design of experiments;
hoses;
humidity;
lighting;
mainframes;
permeability;
rubber;
water;
11.
Duo-CPU Liquid Cooling Loop Configuration: Parallel or Series?
机译:
Duo-CPU液体冷却回路配置:并联还是串联?
作者:
Haoran Chen
;
Yong Han
;
Gongyue Tang
;
Xiaowu Zhang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
energy conservation;
heat sinks;
heat transfer;
microprocessor chips;
power aware computing;
12.
Benchmark Study on Cooling and Reliability Performance Due to Difference in Structure of Power Modules
机译:
由于功率模块结构不同而导致的冷却和可靠性能的基准研究
作者:
Yuta Ito
;
Koichi Ishiyama
;
Qiang Yu
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
bonding processes;
cooling;
fatigue;
finite element analysis;
greases;
heat sinks;
insulating thin films;
reliability;
solders;
13.
3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion
机译:
铜铝丝键合腐蚀的3-D数值多物理场模型
作者:
Pradeep Lall
;
Yunli Zhang
;
Jeff Suhling
;
Luu Nguyen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aluminium;
copper;
corrosion;
corrosion testing;
cracks;
current density;
diffusion;
electric potential;
electrolytes;
electronics packaging;
encapsulation;
finite element analysis;
fracture;
gold;
lead bonding;
metallisation;
14.
Temperature Change Leverage on Performance of MEMS Rotational Motion Sensors
机译:
温度变化对MEMS旋转运动传感器性能的影响
作者:
Jacek Nazdrowicz
;
Andrzej Napieralski
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
finite element analysis;
gyroscopes;
microfabrication;
micromechanical devices;
microsensors;
silicon;
springs (mechanical);
vibrations;
15.
A Numerical Analysis of Conductive Heat Transfer in Cylindrical Thermal Energy Storage Composites
机译:
圆柱型蓄热复合材料导热的数值分析
作者:
Alison Hoe
;
Michael E. Deckard
;
Jonathan Felts
;
Patrick J. Shamberger
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
composite materials;
finite difference methods;
geometry;
heat conduction;
heat sinks;
heat transfer;
numerical analysis;
thermal conductivity;
thermal energy storage;
16.
Modeling Performance and Thermal Induced Reliability Issues of a 3nm FinFET Logic Chip Operation in a Fan-Out and a Flip-Chip Packages
机译:
扇出和倒装芯片封装中的3nm FinFET逻辑芯片操作的建模性能和热感应可靠性问题
作者:
Munkang Choi
;
Xiaopeng Xu
;
Victor Moroz
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
clocks;
cooling;
flip-chip devices;
MOSFET;
RC circuits;
semiconductor device models;
semiconductor device reliability;
technology CAD (electronics);
thermal management (packaging);
thermal resistance;
17.
Transient Thermal Compact Models Time Integration with Python
机译:
瞬态热紧凑模型与Python的时间集成
作者:
Torsten Hauck
;
Vibhash Jha
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
crosstalk;
data visualisation;
electronic engineering computing;
finite element analysis;
thermal management (packaging);
virtual prototyping;
18.
Spatially-Varying Electrothermal Impedance Analysis for Designing Power Semiconductor Converter Systems
机译:
设计功率半导体转换器系统的空间变化电热阻抗分析
作者:
Timothy A. Polom
;
Christoph H. van der Broeck
;
Rik W. De Doncker
;
Robert D. Lorenz
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
frequency response;
heat transfer;
power convertors;
power MOSFET;
power semiconductor devices;
reliability;
thermal management (packaging);
19.
Experimental Characterization of the Dependence of the Poisson's Ratio of Lead Free Solder on Temperature, Strain Rate, Solidification Profile, and Isothermal Aging
机译:
无铅焊料的泊松比与温度,应变速率,凝固曲线和等温时效关系的实验表征
作者:
KM Rafidh Hassan
;
Mohammad S. Alam
;
Munshi Basit
;
Jeffrey C. Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
copper alloys;
crystal microstructure;
deformation;
fatigue;
finite element analysis;
Poisson ratio;
reliability;
silver alloys;
solders;
solidification;
stress-strain relations;
tensile testing;
tin alloys;
torsion;
20.
Micro-Two-Phase Electronics Cooling: Finally on Its Way
机译:
微型两相电子冷却:终于如愿以偿
作者:
John R. Thome
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
boiling;
bubbles;
cooling;
flow visualisation;
microchannel flow;
numerical analysis;
pattern formation;
pipe flow;
two-phase flow;
21.
Phonon Mean Free Path - Thermal Conductivity Relation in AlN
机译:
AlN中声子平均自由程-导热系数关系
作者:
Ilke Albar
;
Nazli Donmezer
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ab initio calculations;
aluminium compounds;
III-V semiconductors;
phonons;
thermal conductivity;
wide band gap semiconductors;
22.
Parametric Compact Thermal Modeling of Power LEDs
机译:
电源LED的参数紧凑热建模
作者:
T. Torzewicz
;
P. Ptak
;
A. Samson
;
T. Raszkowski
;
M. Janicki
;
K. Gorecki
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
light emitting diodes;
lighting;
power semiconductor diodes;
semiconductor device models;
semiconductor device testing;
thermal conductivity;
thermal management (packaging);
23.
Diamond Resistives - The Passive Way to Manage the Heat and Keep the VSWR Low at High Frequencies
机译:
金刚石电阻-被动控制热量并在高频下保持VSWR低的方法
作者:
Firooz Faili
;
Gruffudd Williams
;
Thomas Obeloer
;
Daniel J. Twitchen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
5G mobile communication;
beryllium compounds;
chemical vapour deposition;
diamond;
phased array radar;
resistors;
24.
Economic and Environmental Analysis of U.S.-Based Data Centers Containing Photovoltaic Power Generation
机译:
基于美国的包含光伏发电的数据中心的经济和环境分析
作者:
Li Chen
;
Aaron P. Wemhoff
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
air pollution;
carbon compounds;
computer centres;
investment;
photovoltaic power systems;
power consumption;
power engineering computing;
power generation economics;
power grids;
solar power;
25.
Design Optimization and Characterization of a Mini Heat Exchanger for Data Center Cooling Application
机译:
数据中心制冷应用小型换热器的设计优化与特性
作者:
Gongyue Tang
;
Yong Han
;
Haoran Chen
;
Xiaowu Zhang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
computer centres;
cooling;
energy conservation;
heat exchangers;
thermal management (packaging);
26.
An Optimization Algorithm to Design Compact Plate Heat Exchangers for Waste Heat Recovery Applications in High Power Datacenter Racks
机译:
大功率数据中心机架余热回收应用紧凑型板式换热器的优化算法
作者:
Raffaele L. Amalfi
;
Filippo Cataldo
;
John R. Thome
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computer centres;
condensation;
cooling;
district heating;
energy conservation;
energy consumption;
friction;
heat exchangers;
heat recovery;
optimisation;
pipe flow;
pipes;
refrigeration;
two-phase flow;
waste heat;
27.
Trends in High Performance Computing: Exascale Systems and Facilities Beyond the First Wave
机译:
高性能计算的趋势:超越第一波的百亿亿次系统和设施
作者:
Lynn A. Parnell
;
Dustin W. Demetriou
;
Vinod Kamath
;
Eric Y. Zhang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computer centres;
cooling;
parallel machines;
parallel processing;
power aware computing;
28.
Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications
机译:
穿戴式电子设备的折叠可靠性评估方法
作者:
Pradeep Lall
;
Hyesoo Jang
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
failure analysis;
fatigue;
flexible electronics;
life testing;
printed circuits;
reliability;
29.
Package Design for Multiphysics MEMS Sensor
机译:
多物理场MEMS传感器的包装设计
作者:
Nicolò Manca
;
Marco Del Sarto
;
Alex Gritti
;
Roseanne Duca
;
Vincent Mangion
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
accelerometers;
application specific integrated circuits;
integrated circuit packaging;
microassembling;
microsensors;
motion measurement;
numerical analysis;
printed circuits;
soldering;
temperature measurement;
temperature sensors;
30.
Effect of Sintering Temperature on the Fatigue Life of Additively Printed Electronics During Cyclic Bending
机译:
循环弯曲过程中烧结温度对增材印刷电子疲劳寿命的影响
作者:
Pradeep Lall
;
Jinesh Narangaparambil
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aerosols;
bending;
copper;
electronics industry;
failure (mechanical);
failure analysis;
fatigue;
ink jet printing;
nanoparticles;
rapid prototyping (industrial);
shear strength;
silver;
sintering;
standards;
statistical analysis;
31.
Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying Charge Protocols and C-Rates
机译:
可变充电协议和C费率下浅充电对柔性电源容量的影响
作者:
Pradeep Lall
;
Ved Soni
;
Amrit Abrol
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electrochemical electrodes;
lithium;
lithium compounds;
secondary cells;
32.
Stretchable Selective Emitters based on Carbon Nanotube Films for Adaptive Thermal Control
机译:
基于碳纳米管薄膜的可伸缩选择性发射极,用于自适应热控制
作者:
Xiao Nie
;
Anirudh Krishna
;
Myunghwan Jeong
;
Peng Wu
;
Choongho Yu
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
carbon nanotubes;
emissivity;
Fourier transform infrared spectra;
porosity;
thin films;
ultraviolet spectra;
visible spectra;
33.
Near Field Radiative Emissivity Enhancement with Application in Electronics Cooling
机译:
近场辐射发射率的增强及其在电子冷却中的应用
作者:
Mine Kaya
;
Shima Hajimirza
;
Aliakbar Merrikh
;
Mehdi Saeidi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
emissivity;
radiation effects;
refractive index;
semiconductor materials;
surface texture;
titanium compounds;
34.
Computational Investigation of Nanoscale Memristor Devices for Neuromorphic Computing
机译:
用于神经形态计算的纳米级忆阻器的计算研究
作者:
Darshan G. Pahinkar
;
Pradip Basnet
;
Bill Zivasatienraj
;
Alex Weidenbach
;
Matthew West
;
W. Alan Doolittle
;
Eric Vogel
;
Samuel Graham
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
memristors;
nanoelectronics;
neural nets;
random-access storage;
35.
Molecular Dynamic Simulation of the Effect of Nanocoating on Two-Phase Evaporative Heat and Mass Transfer
机译:
纳米涂层对两相蒸发传热传质的分子动力学模拟
作者:
Binjian Ma
;
Li Shan
;
Junhui Li
;
Baris Dogruoz
;
Damena Agonafer
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
argon;
coatings;
condensation;
cooling;
evaporation;
graphene;
latent heat;
liquid films;
mass transfer;
molecular dynamics method;
silicon;
thermal conductivity;
thermal management (packaging);
thermal resistance;
thin films;
two-phase flow;
wetting;
36.
Numerical Simulations of Pulsating Heat Pipes, Part 1: Modeling
机译:
脉动热管的数值模拟,第1部分:建模
作者:
Philippe Aubin
;
Brian DEntremont
;
Filippo Cataldo
;
Jackson B. Marcinichen
;
Raffaele L. Amalfi
;
John R. Thome
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
boiling;
bubbles;
condensation;
convection;
cooling;
fluid oscillations;
heat conduction;
heat pipes;
liquid films;
numerical analysis;
pipe flow;
two-phase flow;
37.
Numerical Simulations of Pulsating Heat Pipes, Part 2: Comparison to Experimental Data
机译:
脉动热管的数值模拟,第2部分:与实验数据的比较
作者:
Philippe Aubin
;
Filippo Cataldo
;
Jackson B. Marcinichen
;
Raffaele L. Amalfi
;
Sung J. Kim
;
John R. Thome
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
flow simulation;
heat pipes;
heat transfer;
numerical analysis;
pipe flow;
pipes;
silicon;
thermal resistance;
38.
Analytical Model for a Cylindrical Heat Pipe
机译:
圆柱热管的解析模型
作者:
H Venu Madhav
;
Venkata Rauhavendra
;
Pramod Kumar
;
Amrit Ambirajan
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ammonia;
heat pipes;
space vehicles;
temperature measurement;
thermodynamics;
39.
Three Dimensional Heat Pipe Vapor Chamber Design and Performance
机译:
三维热管蒸汽室设计与性能
作者:
Nelson J. Gernert
;
Mark T. North
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
blades;
cooling;
copper;
heat exchangers;
heat pipes;
heat sinks;
pipe flow;
pipes;
thermal conductivity;
thermal management (packaging);
thermal resistance;
water;
40.
Investigation on Performance Difference Between Air and Liquid Close Loop Heatsink in a 1U Server
机译:
1U服务器中空气和液体闭环散热器之间的性能差异研究
作者:
Feng Qi
;
Wenbin Tian
;
Shaorong Zhou
;
Yuehong Fan
;
Ming Zhang
;
Casey Winkle
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
heat exchangers;
heat pipes;
heat transfer;
thermal engineering;
thermal management (packaging);
41.
Advanced Thermal Solution for High Performance Server System Energy Efficiency
机译:
先进的散热解决方案,实现高性能服务器系统的能源效率
作者:
Xianguang Tan
;
Jie Zhao
;
Hongmei Liu
;
Jiajun Zhang
;
Jun Zhang
;
Jialiang Xu
;
Sandeep Ahuja
;
Dayi Zhu
;
Ken Zhang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cache storage;
cloud computing;
computer centres;
cooling;
microprocessor chips;
network servers;
parallel architectures;
power aware computing;
reliability;
thermal management (packaging);
42.
Numerical Convective Heat Transfer Analysis of a Hybrid-Cooled Data Center Blade Server
机译:
混合冷却数据中心刀片服务器的对流传热数值分析
作者:
Sara Battaglioli
;
Assel Sakanova
;
Tim Persoons
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
computer centres;
convection;
cooling;
energy conservation;
energy consumption;
entropy;
genetic algorithms;
heat recovery;
power aware computing;
thermal management (packaging);
waste heat;
43.
Use of Direct Airside Economizers in Thermal Management of Data Centers: Opportunities and Challenges
机译:
在数据中心的热量管理中使用直接空侧省煤器:机遇与挑战
作者:
Huseyin Bostanci
;
Seifollah Nasrazadani
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
air conditioning;
computer centres;
cooling;
energy conservation;
power aware computing;
refrigerants;
refrigeration;
thermal management (packaging);
44.
Uniaxial Creep Response of Double-Layered Pressure Sensitive Adhesive (PSA)
机译:
双层压敏胶粘剂(PSA)的单轴蠕变响应
作者:
Hao Huang
;
Abhijit Dasgupta
;
Ehsan Mirbagheri
;
Krishna Darbha
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
adhesive bonding;
adhesives;
creep;
deformation;
ductility;
surface energy;
surface roughness;
45.
Evolution of the Mechanical Properties of Lead Free Solder Joints Subjected to Mechanical Cycling
机译:
机械循环对无铅焊点力学性能的影响
作者:
Mohd Aminul Hoque
;
Md Mahmudur Chowdhury
;
Sad Hamasha
;
Jeffrey C. Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
copper;
electronics packaging;
failure (mechanical);
fatigue;
nanoindentation;
soldering;
solders;
thermal expansion;
thermomechanical treatment;
46.
Effect of Prolonged Storage Up to 1-Year on Anand Parameters for SAC105 Leadfree Alloys
机译:
长期保存至1年对SAC105无铅合金Anand参数的影响
作者:
Pradeep Lall
;
Vikas Yadav
;
Jeff Suhling
;
David Locker
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
copper alloys;
high-temperature electronics;
reliability;
silver alloys;
solders;
storage;
stress-strain relations;
tensile testing;
tin alloys;
47.
Mechanical Characterization and Microstructural Evolution of SAC and SAC+X Lead Free Solders Subjected to High Temperature Aging
机译:
SAC和SAC + X无铅焊料在高温时效后的力学特性和微观结构演变
作者:
Mohammad S. Alam
;
KM Rafidh Hassan
;
Jeffrey C. Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
copper alloys;
dendrites;
electronics packaging;
reliability;
scanning electron microscopy;
silver alloys;
soldering;
solders;
stress-strain relations;
tensile strength;
tin alloys;
yield stress;
48.
Unprecedented Capillary Evaporative Heat Flux in Nanochannels
机译:
纳米通道中空前的毛细管蒸发热通量
作者:
Masoumeh Nazari
;
Matt Gorman
;
Hadi Ghasemi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
capillarity;
channel flow;
diffusion;
evaporation;
heat transfer;
thermal management (packaging);
thin films;
49.
Reduction of Flow Boiling Instabilities in Microchannels by Periodic Variation of the Channel Cross-Sectional Geometry
机译:
通过通道横截面几何形状的周期性变化减少微通道中流动沸腾的不稳定性
作者:
Le Gao
;
Sushil H. Bhavnani
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
boiling;
bubbles;
channel flow;
cooling;
flow instability;
flow visualisation;
microchannel flow;
mixing;
two-phase flow;
50.
An Experimental Study of a Single Droplet Impacting Onto a Heated Surface at High Impact Weber Numbers
机译:
高冲击韦伯数下单个液滴撞击加热表面的实验研究
作者:
Vaidehi Oruganti
;
Joshua Amurao
;
Mahsa Ebrahim
;
Alfonso Ortega
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
drops;
evaporation;
hydrodynamics;
impact (mechanical);
liquid films;
sprays;
thermocouples;
two-phase flow;
wetting;
51.
Effects of Silicide Inclusion Shape on Thermal Transport of Silicon-Based Nanowires and Nanocomposites for Thermoelectric Applications
机译:
硅化物包裹体形状对热电应用硅基纳米线和纳米复合材料热传输的影响
作者:
Laia Ferrer-Argemi
;
Jonathan Sullivan
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electroless deposition;
elemental semiconductors;
epitaxial growth;
nanocomposites;
nanofabrication;
nanowires;
nickel compounds;
phonons;
ray tracing;
semiconductor growth;
silicon;
sintering;
thermal conductivity;
52.
Leakage-Aware Dynamic Compact Thermal Model for CMOS Technology
机译:
CMOS技术的泄漏感知动态紧凑热模型
作者:
Chi-Wen Pan
;
Pei-Yu Huang
;
Chia-Hao Hsu
;
Sheng-Liang Kuo
;
Tai-Yu Chen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
CMOS integrated circuits;
power capacitors;
resistors;
thermal analysis;
transient analysis;
53.
Enhancement of the Electrical and Thermal Performance of AlGaN/GaN HEMTs Using a Novel Resistive Field Plate Structure
机译:
使用新型电阻场板结构增强AlGaN / GaN HEMT的电学和热学性能
作者:
Bikramjit Chatterjee
;
Tae Kyoung Kim
;
Yiwen Song
;
James Spencer Lundh
;
Sang-Woo Han
;
Daniel Shoemaker
;
Jae Min Lee
;
Moon Uk Cho
;
Rongming Chu
;
Joon Seop Kwak
;
Sukwon Choi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aluminium compounds;
amorphous semiconductors;
gallium compounds;
high electron mobility transistors;
III-V semiconductors;
II-VI semiconductors;
indium compounds;
infrared imaging;
MIS devices;
semiconductor device breakdown;
semiconductor device reliability;
semic;
54.
Electro-Thermal Simulation of Delta-Doped
$oldsymbol{eta}$
-Ga
2
O
3
Field Effect Transistors
机译:
掺杂Delta的
$ boldsymbol { beta} $ tex> -Ga
2 inf> O
3 inf>场效应晶体管的电热模拟
作者:
Nitish Kumar
;
Chandan Joishi
;
Zhanbo Xia
;
Sidhharth Rajan
;
Satish Kumar
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
field effect transistors;
gallium compounds;
passivation;
semiconductor growth;
technology CAD (electronics);
thermal conductivity;
55.
Air-Based Cooling in High Porosity, Aluminum Foams for Compact Electronics Cooling
机译:
高孔隙率的基于空气的冷却,用于紧凑型电子设备冷却的铝泡沫
作者:
Sanskar S. Panse
;
Prashant Singh
;
Srinath V. Ekkad
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aluminium;
channel flow;
cooling;
metal foams;
porosity;
56.
Impact of Solar Radiation on the Thermal Design of Outdoor Enclosures for 5G Devices in Automotive Transmission Platform with Thermal Risk Analysis
机译:
太阳辐射对汽车传输平台5G设备室外机壳散热设计的影响(热风险分析)
作者:
Bhagyashree Ganore
;
Daniel Cox
;
Richard Perry
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
5G mobile communication;
air conditioning;
cooling;
electromagnetic compatibility;
endoscopes;
environmental factors;
risk analysis;
solar radiation;
video streaming;
57.
Thermal Modeling of Air Cooled Outdoor Digital Displays
机译:
风冷户外数字显示器的热建模
作者:
Jeho Kim
;
Yogendra Joshi
;
J. Michael Brown
;
Kevin OConnor
;
Marcos Diaz
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
thermal management (packaging);
58.
Numerical Study of a New Rack Layout for Better Cold Air Distribution and Reduced Fan Power
机译:
新型机架布局的数值研究,以更好地分配冷空气并降低风扇功率
作者:
Xin Xiong
;
Yogesh Fulpagare
;
Chuan Sun
;
Poh Seng Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
air conditioning;
computational fluid dynamics;
computer centres;
fans;
flow simulation;
numerical analysis;
thermal management (packaging);
vortices;
59.
Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders
机译:
掺杂SAC + X焊料的老化引起的微观结构变化的研究
作者:
Jing Wu
;
Sudan Ahmed
;
Jeffrey C. Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
bismuth alloys;
copper alloys;
creep;
crystal microstructure;
dendrites;
diffusion;
particle size;
reflow soldering;
scanning electron microscopy;
silver alloys;
solders;
solid solution hardening;
solidification;
tin alloys;
60.
Experimental Demonstration of an Additively Manufactured Vapor Chamber Heat Spreader
机译:
增材制造的蒸气室散热器的实验演示
作者:
Serdar Ozguc
;
Saeel Pai
;
Liang Pan
;
Patrick J. Geoghegan
;
Justin A. Weibel
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
heat pipes;
laser sintering;
porous materials;
rapid prototyping (industrial);
stainless steel;
thermal resistance;
three-dimensional printing;
61.
Additive Manufacturing of Compact Manifold-Microchannel Heat Exchangers Utilizing Direct Metal Laser Sintering
机译:
利用直接金属激光烧结法制造紧凑型歧管-微通道换热器
作者:
Hadi Keramati
;
Fabio Battaglia
;
Martinus A. Arie
;
Farah Singer
;
Michael M. Ohadi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
heat exchangers;
heat sinks;
heat transfer;
laser sintering;
microchannel flow;
powders;
rapid prototyping (industrial);
steel;
three-dimensional printing;
62.
Thermal Conductivity Measurement of Mesoscale Lattices Using Steady-State Infrared Thermography
机译:
稳态红外热成像法测量中尺度晶格的热导率
作者:
Shiva Farzinazar
;
Lorenzo Valdevit
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electronics packaging;
infrared imaging;
nickel;
porosity;
surface finishing;
thermal conductivity measurement;
thermal insulation;
63.
Spreading Resistance in Flux Channels with Nonuniform Properties and Complex Structures
机译:
具有非均匀特性和复杂结构的助焊剂通道中的扩展阻力
作者:
Belal Al-Khamaiseh
;
Yuri S. Muzychka
;
Serpil Kocabiyik
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
cooling;
electronics industry;
finite element analysis;
heat sinks;
temperature distribution;
thermal resistance;
64.
Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate
机译:
从基板上的散热装置传热的分析
作者:
João Vitor Thomsen Silveira
;
Zidi Li
;
Bolun Yang
;
Ryuta Yasui
;
Takuya Shinoda
;
Kazuyoshi Fushinobu
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
automotive electronics;
cooling;
printed circuits;
reliability;
thermal management (packaging);
65.
Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
机译:
电力电子中低重量定向冷却集成用增材制造的聚合物散热器的传热和压降性能
作者:
Reece Whitt
;
Bakhtiyar Nafis
;
David Huitink
;
Zhao Yuan
;
Amol Deshpande
;
Balaji Narayanasamy
;
Fang Luo
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
heat sinks;
plastics;
plates (structures);
polymers;
power electronics;
rapid prototyping (industrial);
reliability;
thermal management (packaging);
three-dimensional printing;
66.
Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips
机译:
带有微柱式蒸发器的两相蒸气室:从未来的高性能芯片中去除热量的新方法
作者:
Zihao Yuan
;
Geoffrey Vaartstra
;
Prachi Shukla
;
Mostafa Said
;
Sherief Reda
;
Evelyn Wang
;
Ayse K. Coskun
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
evaporation;
finite element analysis;
heat sinks;
microchannel flow;
thermal management (packaging);
67.
An Experimental Study of Single-Phase Heat Transfer inside an Additively Fabricated Microchannel Heat Exchanger
机译:
加成微通道换热器内单相传热的实验研究
作者:
Jiajun Xu
;
Jaime Rios
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
cooling;
heat exchangers;
heat sinks;
laser sintering;
microchannel flow;
rapid prototyping (industrial);
three-dimensional printing;
68.
Reliability of Package on Package (PoP) Assembly Under Thermal Cycles
机译:
热循环下的封装式封装(PoP)组装可靠性
作者:
Reza Ghaffarian
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
assembling;
design of experiments;
failure analysis;
lead alloys;
optical images;
printed circuits;
reliability;
scanning electron microscopy;
soldering;
solders;
thermal management (packaging);
thermal shock;
tin alloys;
X-ray microscopy;
69.
System in Package (SiP) Assembly and Reliability
机译:
系统级封装(SiP)组装和可靠性
作者:
Reza Ghaffarian
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
assembling;
ball grid arrays;
chip scale packaging;
integrated circuit reliability;
scanning electron microscopy;
solders;
system-in-package;
tin alloys;
wafer level packaging;
70.
Design Study to Prevent Mold Delamination for Overmolded Lead Frame Package
机译:
防止过模制引线框封装脱模的设计研究
作者:
Yeonsung Kim
;
Carl Raleigh
;
Shafi Saiyed
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
chip scale packaging;
copper;
cracks;
deformation;
delamination;
encapsulation;
failure analysis;
finite element analysis;
fracture;
integrated circuit packaging;
integrated circuit reliability;
lead bonding;
moulding;
plastic packaging;
reliability;
semiconductor devic;
71.
A Measurement Technique for Thermal Conductivity Characterization of Ultra-High Molecular Weight Polyethylene Yarns Using High-Resolution Infrared Microscopy
机译:
高分辨率红外显微技术表征超高分子量聚乙烯纱导热系数的测量技术
作者:
Aaditya A. Candadai
;
Justin A. Weibel
;
Amy M. Marconnet
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
heat transfer;
infrared imaging;
polymers;
thermal conductivity;
thermal conductivity measurement;
thermal management (packaging);
yarn;
72.
Two-Color Laser Induced Fluorescence Measurements of Natural Convection in a Dielectric Fluid
机译:
介电流体中自然对流的双色激光诱导荧光测量
作者:
Rachel McAfee
;
Bryce Cox
;
Joshua Gess
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
calibration;
copper;
dyes;
flow measurement;
fluorescence;
natural convection;
temperature measurement;
73.
Identifying Hot Spots in Electronics Packages with a Sensitivity-Coefficient Based Inverse Heat Conduction Method
机译:
基于灵敏度系数的逆导热方法识别电子封装中的热点
作者:
Patrick Krane
;
David Gonzalez Cuadrado
;
Francisco Lozano
;
Guillermo Paniagua
;
Amy Marconnet
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electronics packaging;
finite volume methods;
heat conduction;
heat transfer;
inverse problems;
temperature measurement;
74.
Step-by-Step Guide to Determining Experimental Uncertainty in Thin-Film Resistance
机译:
确定薄膜电阻实验不确定性的分步指南
作者:
Michael C. Fish
;
Lauren M. Boteler
;
Morris S. Berman
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
calibration;
data acquisition;
digital multimeters;
electric resistance measurement;
measurement uncertainty;
regression analysis;
temperature measurement;
temperature sensors;
thermal resistance measurement;
thermocouples;
thin film resistors;
75.
Integrating Heat Sinks into a 3D Co-Design Network Model for Quick Parametric Analysis
机译:
将散热器集成到3D协同设计网络模型中以进行快速参数分析
作者:
Lauren M. Boteler
;
Steven M. Miner
;
Michael Fish
;
Morris Berman
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
electronics packaging;
finite element analysis;
heat sinks;
heat transfer;
thermal management (packaging);
76.
Accurate Modeling of Forced Convection Cooling for Microelectronic Packages: Numerical and Experimental Thermal Studies
机译:
微电子封装强制对流冷却的精确建模:数值和实验热学研究
作者:
Mamadou Kabirou Toure
;
Papa Momar Souare
;
Benoit Foisy
;
Eric Duchesne
;
Julien Sylvestre
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
finite element analysis;
forced convection;
heat sinks;
heat transfer;
natural convection;
numerical analysis;
temperature distribution;
thermal conductivity;
thermal management (packaging);
thermal resistance;
wind tunnels;
77.
Multi-port Dynamic Compact Thermal Models of BGA Package using Model Order Reduction and Metaheuristic Optimization
机译:
基于模型降阶和元启发式优化的BGA封装多端口动态紧凑热模型
作者:
Valentin Bissuel
;
Vincent Fox
;
Eric Monier-Vinard
;
Alain Neveu
;
Frédéric Joly
;
Olivier Daniel
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ball grid arrays;
circuit simulation;
integrated circuit modelling;
optimisation;
reduced order systems;
thermal management (packaging);
thermal resistance;
78.
Pool Boiling Experiment of Dielectric Liquids and Numerical Study for Cooling a Microprocessor
机译:
电介质液体的池沸腾实验及冷却微处理器的数值研究
作者:
Omidreza Ghaffari
;
Francis Grenier
;
Jean-François Morissette
;
Martin Bolduc
;
Simon Jasmin
;
Julien Sylvestre
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
boiling;
cooling;
copper;
dielectric liquids;
heat sinks;
silicon;
thermal conductivity;
thermal management (packaging);
thermal resistance;
79.
Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins
机译:
波浪状鳍片嵌入介孔中的共振流脉动的实验研究
作者:
Jaakko McEvoy
;
Tim Persoons
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
channel flow;
cooling;
data handling;
flow visualisation;
heat sinks;
laminar flow;
thermal management (packaging);
two-phase flow;
80.
Particulate Functionalized Nanodiamond as a Low Concentration Additive to Liquid Systems to Enhance Their Thermal Extraction Capability
机译:
微粒功能化的纳米金刚石作为液体系统的低浓度添加剂,可增强其热萃取能力
作者:
Farzin Mashali
;
Ethan M. Languri
;
Jim Davidson
;
David Kerns
;
Blake Branson
;
Wayne Johnson
;
Lino Costa
;
Kathleen Lansford
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
bonds (chemical);
convection;
cooling;
diamond;
heat sinks;
nanofluidics;
nanoparticles;
thermal conductivity;
thermal management (packaging);
two-phase flow;
viscosity;
water;
81.
Compact Liquid Cooling Module Incorporating Metal Foam and Fin Hybrid Structures for High Power IGBTs
机译:
紧凑型液体冷却模块,结合金属泡沫和鳍式混合结构,用于大功率IGBT
作者:
Jooyoung Lee
;
Seokkan Ki
;
Youngsuk Nam
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
cooling;
copper;
electric vehicles;
heat sinks;
insulated gate bipolar transistors;
metal foams;
porosity;
porous materials;
thermal conductivity;
thermal management (packaging);
thermal resistance;
82.
Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments
机译:
汽车环境中无铅焊料在高温振动中的可靠性
作者:
Pradeep Lall
;
Vikas Yadav
;
Jeff Suhling
;
David Locker
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
automotive engineering;
ball grid arrays;
cameras;
data acquisition;
dynamic testing;
failure analysis;
finite element analysis;
printed circuits;
reliability;
solders;
tensile testing;
viscoplasticity;
83.
Effect of Shock Pulse Variation on Surface Mount Electronics under High-G Shock
机译:
高G冲击下冲击脉冲变化对表面贴装电子的影响
作者:
Pradeep Lall
;
Aathi Raja Ram Pandurangan
;
Kalyan Dornala
;
Jeff Suhling
;
John Deep
;
Ryan Lowe
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
avionics;
ball grid arrays;
ceramic capacitors;
fine-pitch technology;
printed circuit testing;
radiation hardening (electronics);
surface mount technology;
84.
Effect of Elevated Storage Temperature on the High Strain Rate Mechanical Properties of SAC305 Solder
机译:
储存温度升高对SAC305焊料高应变率机械性能的影响
作者:
Pradeep Lall
;
Vishal Mehta
;
Jeff Suhling
;
Ken Blecker
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
lead;
solders;
stress-strain relations;
temperature;
tensile testing;
viscoplasticity;
85.
Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature
机译:
在非常高的工作温度下,以高应变速率长期储存长达1年后,SAC-Q焊料合金的Anand参数的演变
作者:
Pradeep Lall
;
Vikas Yadav
;
Jeff Suhling
;
David Locker
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
avionics;
finite element analysis;
reliability;
solders;
strain measurement;
stress-strain relations;
tensile testing;
thermal stress cracking;
viscoplasticity;
86.
Experimental Characterization of a Manifold-Microchannel Heat Exchanger Fabricated Based on Additive Manufacturing
机译:
基于增材制造的歧管-微通道换热器的实验表征
作者:
William C. Yameen
;
Nathan A. Piascik
;
Riccardo C. Clemente
;
Andrew K. Miller
;
Seyed A. Niknam
;
Jingru Benner
;
Anthony D. Santamaria
;
Mehdi Mortazavi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
cooling;
heat exchangers;
heat transfer;
laser sintering;
microchannel flow;
specific heat;
87.
Maximizing the Performance of a 3D Printed Heat Sink by Accounting for Anisotropic Thermal Conductivity During Filament Deposition
机译:
通过考虑细丝沉积过程中的各向异性热导率来最大化3D打印散热器的性能
作者:
Matthew Smith
;
Seokpum Kim
;
Alexander Lambert
;
Maxwell Walde
;
John Lindahl
;
Kaustubh Mungale
;
Thomas Bougher
;
Ahmed Arabi Hassen
;
Vlastimil Kunc
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
coating techniques;
composite materials;
conducting polymers;
finite element analysis;
heat sinks;
materials properties;
thermal conductivity;
three-dimensional printing;
88.
Effect of Print Parameters on Print Consistency of Aerosol Jet Printed Electronics
机译:
打印参数对气溶胶喷射印刷电子产品打印一致性的影响
作者:
Pradeep Lall
;
Amrit Abrol
;
Nakul Kothari
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aerosols;
electronics industry;
flexible electronics;
ink jet printing;
nozzles;
particle size;
process capability analysis;
rapid prototyping (industrial);
scanning electron microscopy;
silver;
surface topography measurement;
89.
Reliability of Additively Printed Traces on Polymer Substrates Subjected to Mechanical Stretching
机译:
经受机械拉伸的聚合物基板上附加印刷迹线的可靠性
作者:
Pradeep Lall
;
Kartik Goyal
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
adhesion;
bending;
curing;
deformation;
electrical conductivity;
electronics industry;
flexible electronics;
polymers;
silver;
90.
Experimental Demonstration of Heat Pipe Operation beyond the Capillary Limit during Brief Transient Heat Loads
机译:
短暂瞬态热负荷下热管运行超出毛细管极限的实验演示
作者:
Kalind Baraya
;
Justin A. Weibel
;
Suresh V. Garimella
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
capillarity;
cooling;
evaporation;
heat pipes;
thermal management (packaging);
two-phase flow;
91.
High Temperature Lightweight Heat Pipes for Solid-State Power Amplifier (SSPA) Thermal Management
机译:
固态功率放大器(SSPA)热管理用高温轻型热管
作者:
Mohammed T. Ababneh
;
Calin Tarau
;
William G. Anderson
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
artificial satellites;
cooling;
gallium compounds;
heat pipes;
III-V semiconductors;
power amplifiers;
space vehicle electronics;
thermal management (packaging);
wide band gap semiconductors;
92.
Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems
机译:
小型卫星系统薄型扁平热管设计优化工具的开发与应用
作者:
Steven A. Isaacs
;
Peter E. Hamlington
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
artificial satellites;
cooling;
design engineering;
heat pipes;
minimisation;
93.
Characterization of an Embedded Heat Pipe Heat Sink for Multiple Heat Sources for Power Electronics Applications
机译:
用于电力电子应用的多种热源的嵌入式热管散热器的特性
作者:
Neda Mansouri
;
Ahmed Zaghlol
;
Cliff Weasner
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
copper;
design engineering;
heat pipes;
heat sinks;
insulated gate bipolar transistors;
numerical analysis;
power electronics;
94.
Waste Heat Recovery Using Coupled 2-Phase Cooling Heat-Pump Driven Absorption Refrigeration
机译:
使用两相冷却和热泵驱动吸收式制冷的余热回收
作者:
R. Khalid
;
S. G. Schon
;
A. Ortega
;
A. P. Wemhoff
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computer centres;
environmental economics;
heat pumps;
heat recovery;
refrigeration;
thermodynamics;
waste heat;
95.
Rack Thermal Model Prediction Accuracy Improvement by Utilizing Rack Power Consumption as Modelling Feature
机译:
通过利用机架功耗作为建模功能来提高机架热模型的预测精度
作者:
Nirmal S. Rajput
;
Yoshinori Miyamoto
;
Takafumi Natsumeda
;
Minoru Yoshikawa
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
air conditioning;
computer centres;
data analysis;
fans;
indoor environment;
power consumption;
temperature distribution;
96.
Experimental Demonstration of Local Air Conditioning System Utilizing Low-Pressure Refrigerant at Data Center
机译:
在数据中心使用低压制冷剂的本地空调系统的实验演示
作者:
Yoshinori Miyamoto
;
Koichi Todoroki
;
Takafumi Natsumeda
;
Nirmal Rajput
;
Masaki Chiba
;
Minoru Yoshikawa
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
air conditioning;
compressors;
global warming;
heat exchangers;
pipes;
refrigerants;
refrigeration;
97.
Full-scale Two-phase Liquid Immersion Cooing Data Center System in Tropical Environment
机译:
热带环境下的全尺寸两相浸液冷却数据中心系统
作者:
Chenlong Wu
;
Wei Tong
;
Baris Burak Kanbur
;
Fei Duan
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computer centres;
computerised instrumentation;
coolants;
cooling;
data acquisition;
dielectric liquids;
exergy;
flow sensors;
flowmeters;
level measurement;
network servers;
pressure measurement;
pressure sensors;
temperature distribution;
temperature measurement;
temp;
98.
Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
机译:
焊点疲劳寿命预测与几种长期测试结果的比较
作者:
Rainer Dudek
;
Kerstin Kreyssig
;
Sven Rzepka
;
Michael Novak
;
Wolfgang Gruebl
;
Peter Fruehauf
;
Andreas Weigert
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
failure analysis;
fatigue;
finite element analysis;
life testing;
reliability;
soldering;
solders;
99.
Effect of Aging on Component Reliability in Harsh Thermal Cycling
机译:
苛刻热循环中时效对部件可靠性的影响
作者:
Francy John Akkara
;
Cong Zhao
;
Seth Gordon
;
Sinan Su
;
Mohammed Abueed
;
Sad Hamasha
;
Jeff Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
ball grid arrays;
copper alloys;
integrated circuit packaging;
integrated circuit reliability;
integrated circuit testing;
silver alloys;
solders;
thermal management (packaging);
tin alloys;
100.
Effects of Aging on the Damage Accumulation in SAC305 Lead Free Solders Subjected to Cyclic Loading
机译:
时效对循环载荷下SAC305无铅焊料损伤累积的影响
作者:
Md Mahmudur R. Chowdhury
;
Mohd Aminul Hoque
;
Jeffrey C. Suhling
;
Sad Hamasha
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
copper alloys;
dendritic structure;
fatigue cracks;
fatigue testing;
grain boundaries;
microcracks;
nanoindentation;
optical microscopy;
particle size;
scanning electron microscopy;
silver alloys;
solders;
tin alloys;
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