The Epoxy Molding Compound (EMC) with biphenyl resins and highly loaded fillers can retard flammability and is a green material. A highly loaded filler is critical to producing reliable packaging materials for microelectronic devices, with high flame retardation, high thermal resistance, high moisture resistance, favorable mechanical properties and a low thermal expansion coefficient of EMC. In this work, a new organophosphine thermally latent accelerator, triphenyl phosphine-benzoquino (TPP-BQ), was synthesized with variously sized TPP-BQ particles. It was used in the high filler-loaded EMCs that were based on the biphenyl epoxy. EMCs with 92 wt% filler contents are accelerated by the latent heat accelerator, TPP-BQ, which has an excellent flowability in the molding process. Additionally, the effects of the latent accelerator on the activity, thermal behavior, rheology and molding characteristics of EMCs were investigated.
展开▼
