Electrochemical Migration Investigations on SAC-Bi-xMn Solder Alloys

摘要

Water drop (WD) test was applied to get more information about the electrochemical migration (ECM) behaviour on various SAC-Bi-xMn alloys using NaCI and Na2S04 solutions. ECM is sort of electrical short failure process, which can resulted in series failure in case of loaded circuits, when humidity appears on/in a conductor-dielectric-conductor structure. The results show that the higher Mn content solder alloys showed relative low Mean Time To Failure (MTTF) values, while in the case of Bi content solder alloys relative higher MTTF values were calculated.