The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering

摘要

Currently, Ball Grid Array (BGA) package is becoming the most wildly used semiconductor packaging type. When BGA packages are subject to elevated temperatures during reflow soldering, warpage, or shape deformation occurs. Many solder joint failure modes may be caused by warpage, such as bridging, non-wetting and stretched-joint etc. In this paper, we tried first to characterize the BGA package warpage with shadow moiré method. Based on such studies, warpage of BGA packages with different dimension, material (plastic or ceramic) and heat dissipation way during lead-free reflow soldering was measured, as a result, the law and influence factor of BGA package warpage were revealed and investigated. The warpage of PBGA package were also studied by finite element simulation in this paper. Finally, a case study of BGA solder joint failure was introduced and the effect of package’s warpage on BGA’s solder joint interconnection was studied.