The application and case study of FIB system in the PCB with OSP final finish failure analysis

摘要

The two traditional methods to measure the thickness of OSP final finish are introduced in this paper. The advantages and the disadvantages of these methods are also briefly discussed. Then according to the working principle, this paper focuses on introducing the convenient methods of FIB to measure the thickness of OSP final finish. By means of poor wettability failure case study, the advantage of the innovation method compared to the traditional methods is introduced in this paper. And the study will present an innovative idea for poor wettability failure analysis on the OSP final finish PCB.