首页> 外文会议>ASME international conference on nanochannels, microchannels and minichannels >EXPERIMENTAL INVESTIGATIONS ON THERMAL PERFORMANCE OF PCM BASED HEAT SINK FOR PASSIVE COOLING OF ELECTRONIC COMPONENTS
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EXPERIMENTAL INVESTIGATIONS ON THERMAL PERFORMANCE OF PCM BASED HEAT SINK FOR PASSIVE COOLING OF ELECTRONIC COMPONENTS

机译:电子元器件被动冷却的基于PCM的热沉热性能的实验研究

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摘要

In the present experimental study, an attempt has been made to study the efficient thermal management system based on phase change material for cooling of portable electronic devices. Paraffin wax is used as PCM to keep the temperature of electronic devices below critical temperature by absorbing thermal energy released by electronic components. PCM is filled inside the heat sink made of aluminum. Four different configuration of heat sink such as unfinned heat sink filled with pure PCM, two finned heat sink filled with pure PCM, unfinned heat sink filled with MF-PCM composite and two finned heat sink filled with MF-PCM composite are used in the present investigation to enhance the operating time of heat sink to reach critical set point temperature. Unfinned heat sink filled with and without PCM is used for baseline comparison. Effect of volume fraction of PCM, effect of heat flux and enhancement in operating time are reported in this study. Enhancement ratios are obtained for various heat sink configurations. The comparison of thermal performance of different configuration shows that higher enhancement ratio and effective thermal control is obtained with two finned metal foam heat sink.
机译:在本实验研究中,已经尝试研究基于相变材料的高效热管理系统,以冷却便携式电子设备。石蜡用作PCM,通过吸收电子组件释放的热能将电子设备的温度保持在临界温度以下。 PCM填充在铝制散热器的内部。目前使用了四种不同配置的散热器,例如填充有纯PCM的无鳍散热器,两个填充有纯PCM的鳍状散热器,填充有MF-PCM复合材料的无鳍散热器和两个填充有MF-PCM复合材料的鳍状散热器。进行研究以延长散热器达到关键设定点温度的时间。装满和不装PCM的未翅片散热器用于基线比较。这项研究报道了PCM的体积分数,热通量的影响以及工作时间的增加。获得了各种散热器配置的增强比。对不同结构的热性能进行比较,结果表明,使用两个翅片金属泡沫散热器可获得更高的增强比和有效的热控制。

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