A Study of the Influence of Solder Thickness on the Thermal Resistance of Power VDMOS Device Package

机译：焊料厚度对功率VDMOS封装热阻影响的研究

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The thermal resistance of the power VDMOS device is an important parameter reflecting its thermal characteristics and reliability. The solder layer is one of the most important component which has a great influence on the thermal resistance. In this paper, three different power VDMOS in ITO-220 package are used as samples to analyze the relationship between the thickness of the solder layer and the thermal resistance. Through the results of finite element simulation and experiment, it is concluded that the thermal resistance is approximately linear with the thickness of solder layer.

机译：功率VDMOS器件的热阻是反映其热特性和可靠性的重要参数。焊料层是最重要的组成部分之一，对热阻有很大影响。在本文中，使用ITO-220封装中的三种不同功率VDMOS作为样品，以分析焊料层的厚度与热阻之间的关系。通过有限元模拟和实验的结果，得出结论，热阻与焊料层的厚度大致线性。

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《International Conference on Communications, Circuits and Systems》|2018年|518p|共4页
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作者
Wei Gao; Yining Ma; Zhaofeng Sun; Pengfei Yin; Min Ren; Jinping Zhang; Zehong Li; Bo Zhang; Wenbo Du;
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中图分类通信;
关键词
Thermal resistance; Electronic packaging thermal management; Electrical resistance measurement; Temperature measurement; Heating systems; Semiconductor device measurement;

机译：热阻;电子包装热管理;电阻测量;温度测量;加热系统;半导体器件测量;

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2. Study of Al-Cu compounds as soldering bond pad for high-power device packaging [J] . Liu Wei Chih, Chen Yan Hao, Chung Te Yuan, Microelectronics & Reliability . 2015,第12PTaA期

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3. Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling [J] . S. B. Park, Rahul Joshi, Izhar Ahmed, Journal of Electronic Packaging . 2008,第4期

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4. A Study of the Influence of Solder Thickness on the Thermal Resistance of Power VDMOS Device Package [C] . Wei Gao, Yining Ma, Zhaofeng Sun, International Conference on Communications, Circuits and Systems . 2018

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A Study of the Influence of Solder Thickness on the Thermal Resistance of Power VDMOS Device Package

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