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C-V Measurement under Different Frequencies and Pulse-mode Voltage Stress to Reveal Shallow and Deep Trap Effects of GaN HEMTs

机译:在不同频率和脉冲模式电压应力下进行C-V测量以揭示GaN HEMT的浅陷阱效应和深陷阱效应

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In this work, the influence of interface traps at the Si3N4/ (GaN) / AlGaN interface and carbon-related buffer traps on AlGaN/GaN-on-silicon high electron mobility transistors (HEMTs) has been studied using high-frequency capacitance-voltage (HFCV) and quasi-static C- V (QSCV) measurement. The correlation between Ron degradation and two different traps distributions subjected to different operation conditions have been investigated. Deep-level traps from the hole-emission process of carbon-related buffer have been activated by high drain voltage under off-state in pulse-mode condition and shallow-level traps from interface states are observed with an increase in gate voltage under on-state.
机译:在这项工作中,Si处的界面陷阱的影响 3 ñ 4 使用高频电容电压(HFCV)和准静态C-V(QSCV)研究了AlGaN /硅上GaN高电子迁移率晶体管(HEMT)上的/(GaN)/ AlGaN界面和碳相关的缓冲陷阱) 测量。研究了Ron降解与在不同操作条件下的两个不同陷阱分布之间的相关性。在脉冲模式条件下,处于关态的高漏极电压激活了碳相关缓冲剂的空穴发射过程中的深层陷阱,而在导通状态下,随着栅极电压的升高,观察到了来自界面态的浅层陷阱。状态。

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