首页> 外文会议>International Conference on Modern Circuits and Systems Technologies >Extending a 65nm CMOS process design kit for high total ionizing dose effects
【24h】

Extending a 65nm CMOS process design kit for high total ionizing dose effects

机译:扩展65nm CMOS工艺设计套件以实现高总电离剂量效果

获取原文

摘要

Standard CMOS Process Design Kits (PDKs) do not address degradation the technology incurs when exposed to high Total Ionizing Dose (TID). Front-end electronics for the High-Luminosity Large Hadron Collider are expected to be exposed up to ten-fold doses. Bulk CMOS at 65 nm is a strong contender for such electronics due to a favorable trade-off among cost, performance, and TID-sensitivity. The present paper presents the extension of a foundry-provided PDK to cover also high TID effects. TID experiments have been carried out up to 500 Mrad. The PDK is based on binned BSIM4 models, which are adapted to different TID levels. Hence, designers may choose among different TID levels for their designs, contributing importantly to radiation-hard design practice.
机译:标准CMOS工艺设计套件(PDK)不能解决技术在暴露于高总电离剂量(TID)时引起的性能下降。高亮度大型强子对撞机的前端电子设备预计将暴露十倍的剂量。由于在成本,性能和TID灵敏度之间取得了良好的折衷,因此65 nm的CMOS成为此类电子产品的有力竞争者。本文介绍了代工厂提供的PDK的扩展,以涵盖高TID效应。 TID实验已进行到500 Mrad。 PDK基于合并的BSIM4模型,该模型适用于不同的TID级别。因此,设计人员可以在其设计的不同TID级别中进行选择,这对防辐射设计实践至关重要。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号