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Analysis of SiC MOSFET dI/dt and its temperature dependence

机译:SiC MOSFET dI / dt及其温度依赖性的分析

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An analysis of variation of drain current (dID/dt) of silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) in turn-on and turn-off under different temperatures has been performed in this paper. It is shown that the magnitude of turn-off dID/dt is temperature dependent and decreases with temperature with a fixed supply voltage, load current and gate resistance. While, the turn-on dID/dt increases with increasing temperature. It has been demonstrated that the temperature dependency of variation of drain current results from the positive temperature dependency of the intrinsic carrier concentration and the negative temperature dependency of the effective mobility of the electrons in SiC MOSFET. The temperature dependency of dID/dt is strongly correlated with gate resistance, which varies with different gate resistors. In addition, the effects of supply voltage and load current have also been discussed. The temperature dependence characterization of variation of drain current for SiC MOSFETs is derived. The comparisons between the calculated results using the derived model and the measurements show the calculations generally fit the measurements well. These results are beneficial in condition monitoring of power devices, operating temperature and device reliability.
机译:分析碳化硅(SiC)金属氧化物半导体场效应晶体管(MOSFET)在不同温度下导通和关断时漏极电流(dI D / dt)的变化具有已经在本文中进行过。结果表明,截止dI D / dt的大小与温度有关,并且在固定的电源电压,负载电流和栅极电阻的情况下,随温度的升高而减小。同时,开启dI D / dt随着温度的升高而增加。业已证明,漏极电流变化的温度相关性是由本征载流子浓度的正温度相关性和SiC MOSFET中电子的有效迁移率的负温度相关性引起的。 dI D / dt的温度依赖性与栅极电阻密切相关,栅极电阻随栅极电阻的不同而变化。此外,还讨论了电源电压和负载电流的影响。得出了SiC MOSFET漏极电流变化的温度依赖性特征。使用派生模型的计算结果与测量值之间的比较表明,计算结果通常与测量值非常吻合。这些结果有利于电力设备的状态监测,工作温度和设备可靠性。

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