Development of a microcamera with embedded image processor using panel level packaging

摘要

In the upcoming Internet of Things era there is a strong demand for smart miniaturized sensors, which can be integrated in all kinds of environments, from industry to medical. Microcameras with real time image processing can serve a wide range of applications like face or gesture recognition as well as traffic sign detection or lane departure warning. Today's microcameras consist of an optics module with lenses and image sensor, which is attached by a flex cable or connector to one or more PCB's with image processor and other required components. Drawback of this construction is limited reliability, relatively large size and high cost. This paper describes the development and realization of an extremely compact microcamera module using a highly efficient Panel Level Packaging (PLP) technology. Most components are embedded into a PCB of 16×16 mm2 size and 3.6 mm thickness with a weight of only 2 g. On top of the PCB a 3 MPixel image sensor is soldered. The basis of the module is a Cognivue image processor. Additionally the module contains 256 Mbit Flash Memory, 5 DC/DC converters, an oscillator and several passives. In total 74 components are embedded into the PCB. The module was completely realized on PCB format with in total 77 modules per 12"x9" panel. All process steps, from component assembly to final test, were performed on panel level. The system design and PLP manufacturing process will be described in detail.