The influence of corner bonding and underfilling techniques on the reliability of 3D TMV PoP structures in SMT assembly

摘要

The paper shows the results of investigation of quality and reliability of soldered joints in 3D TMV PoP structures after assembly using corner bonding and underfilling techniques processes. The 3D solder joints reliability studies were realized using thermal shocks (TS). The results showed that underfilling technique the most positive influences on the 3D TMV PoP structures reliability, but other technological and materials parameters have to be taken into consideration during their assembly process planning. The usage of no optimal technological parameters during the 3D TMV PoP structures assembly decreased reliability of their solder joints up to 30%.