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Impact of transistor scaling on the time-dependent dielectric breakdown (TDDB) reliability of analog circuits

机译:晶体管缩放对模拟电路随时间变化的介电击穿(TDDB)可靠性的影响

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This paper discusses the dielectric breakdown reliability of a two-stage operational amplifier across four short-channel device technologies. For a long time, time dependent dielectric breakdown (TDDB) impact was only confined to digital circuits as the electric field across the gate oxide is relatively large despite being applied in accordance with the activity factor. However, in analog circuits, electric field is generally smaller, though it is constant. One particular aspect that was of interest is the change in TDDB reliability of analog circuits when the device technology descends into deep nanoscale regime. This paper shows that the amplifier reliability becomes mostly enhanced as the transistor technology scales down from 90nm to 32 nm.
机译:本文讨论了跨四种短通道器件技术的两级运算放大器的介电击穿可靠性。长期以来,时间依赖性电介质击穿(TDDB)的影响仅局限于数字电路,因为尽管根据活性因子施加了跨栅氧化物的电场相对较大。但是,在模拟电路中,电场虽然恒定,但通常较小。令人感兴趣的一个特定方面是,当器件技术下降到深纳米级范围时,模拟电路的TDDB可靠性就会发生变化。本文表明,随着晶体管技术从90nm缩小到32nm,放大器的可靠性得到了最大程度的提高。

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