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Influence of post deposition annealing temperatures on electrical properties of Al2O3/InSb MOSCAPs

机译:后沉积退火温度对Al2O3 / INSB晶片模型电性能的影响

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The influence of post deposition annealing (PDA) temperatures on electrical characteristics of Al2O3/InSb metal-oxide-semiconductor capacitor (MOSCAP) structures is investigated. Low frequency C-V responses with strong inversion behavior in the whole range of measured frequency (100 Hz-1 MHz) are observed, indicating very short minority carrier response time in InSb. The PDA temperature of 300oC and above would result in the reduction of maximum capacitance. At the PDA temperature of above 300oC the C-V hysteresis, frequency dispersion and stretch out increases significantly, indicating the degradation of the MOSCAP structures. The degradation might relate to the interdiffusion between Al2O3 and InSb during thermal steps.
机译:研究了沉积退火(PDA)温度对Al 2 O 3 / INSB金属氧化物 - 半导体电容器(MOSCAP)结构的电气特性的影响。 观察到在整个测量频率(100Hz-1MHz)范围内具有强反转行为的低频C-V响应,在INSB中表示非常短的少数载波响应时间。 PDA温度为300 O C及以上的PDA温度将导致最大电容的降低。 在PDA温度高于300 O c C-V滞后,频率分散和拉伸显着增加,表明了Moscap结构的劣化。 劣化可能与热步骤期间Al 2 和INSB之间的相互作用有关。

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