首页> 外文会议>2012 10th IEEE International Conference on Semiconductor Electronics. >Influence of post deposition annealing temperatures on electrical properties of Al2O3/InSb MOSCAPs
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Influence of post deposition annealing temperatures on electrical properties of Al2O3/InSb MOSCAPs

机译:沉积后退火温度对Al2O3 / InSb MOSCAPs电性能的影响

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摘要

The influence of post deposition annealing (PDA) temperatures on electrical characteristics of Al2O3/InSb metal-oxide-semiconductor capacitor (MOSCAP) structures is investigated. Low frequency C-V responses with strong inversion behavior in the whole range of measured frequency (100 Hz-1 MHz) are observed, indicating very short minority carrier response time in InSb. The PDA temperature of 300oC and above would result in the reduction of maximum capacitance. At the PDA temperature of above 300oC the C-V hysteresis, frequency dispersion and stretch out increases significantly, indicating the degradation of the MOSCAP structures. The degradation might relate to the interdiffusion between Al2O3 and InSb during thermal steps.
机译:研究了后退火温度(PDA)对Al 2 O 3 / InSb金属氧化物半导体电容器(MOSCAP)的电学特性的影响。观察到在整个测量频率范围(100 Hz-1 MHz)中具有强烈反转特性的低频C-V响应,表明InSb中的少数载流子响应时间非常短。 PDA温度在300℃或更高时会导致最大电容的降低。在PDA温度高于300°C时,C-V磁滞,频率色散和扩展明显增加,表明MOSCAP结构的退化。降解可能与Al 2 O 3 和InSb在热处理过程中的相互扩散有关。

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