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Highly Scalable 2nd-Generation 45-nm Split-Gate Embedded Flash with 10-ns Access Time and 1M-Cycling Endurance

机译:具有10ns访问时间和1M循环寿命的高度可扩展的第二代45nm分离门嵌入式闪存

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We present a highly scalable 2nd generation 45-nm split-gate embedded flash, which has been scaled of 40% unit-cell-size (almost same size with 28-nm technology node) from the 1st generation 45-nm embedded flash without using extra masks, processes and advanced-equipment. By optimizing process of triple-gate flash architecture and implementing several design methodologies, high speed operation (10ns random access time, 25us write time and less than 2ms erase operation) and robust reliability (1M cycle, 20 retention) are achieved. It has been successfully verified in range of 1Mb up to 16Mb density flash IPs
机译:我们展示了一种高度可扩展的第二代45 nm分裂门嵌入式闪存,它已从第一代45纳米嵌入式闪存扩展到40%的晶胞尺寸(与28纳米技术节点几乎相同的尺寸)额外的掩膜,工艺和先进设备。通过优化三栅极闪存架构的过程并实施几种设计方法,可以实现高速操作(10ns随机访问时间,25us写入时间和小于2ms的擦除操作)和强大的可靠性(1M周期,20个保留时间)。它已经成功验证了1Mb至16Mb密度的闪存IP的范围

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