首页> 外文期刊>Solid-State Circuits, IEEE Journal of >A 28 nm Embedded Split-Gate MONOS (SG-MONOS) Flash Macro for Automotive Achieving 6.4 GB/s Read Throughput by 200 MHz No-Wait Read Operation and 2.0 MB/s Write Throughput at Tj of 170$^{circ}$ C
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A 28 nm Embedded Split-Gate MONOS (SG-MONOS) Flash Macro for Automotive Achieving 6.4 GB/s Read Throughput by 200 MHz No-Wait Read Operation and 2.0 MB/s Write Throughput at Tj of 170$^{circ}$ C

机译:用于汽车的28 nm嵌入式分栅MONOS(SG-MONOS)闪存宏通过170 MHz的200 MHz无等待读取操作实现了6.4 GB / s的读取吞吐量,在170的Tj处实现了2.0 MB / s的写入吞吐量<公式> > $ ^ {circ} $ C

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摘要

First-ever 28 nm embedded split-gate MONOS (SG-MONOS) flash macros have been developed to increase memory capacity embedded in micro controller units and to improve performance over wide junction temperature range from to 170 as demanded strongly in automotive uses. Much attention has been paid to the degradation of the reliability characteristics along with the process shrinkage. Temperature-adjusted word-line overdrive scheme improves random read access frequency by 15% and realizes both of 6.4 GB/s read throughput by 200 MHz no-wait random access of code flash macros and more than ten times longer TDDB lifetime of WL drivers. Temperature-adaptive step pulse erase control (TASPEC) improves the TDDB lifetime of dielectric films between metal interconnect layers by three times. TASPEC is particularly useful for a data flash macro with one million rewrite cycles. Source-side injection (SSI) program with negative back-bias voltage achieves 63% reduction of program pulse time and, consequently, realizes 2.0 MB/s write throughput of code flash macros. A spread spectrum clock generation and a clock phase shift technique are introduced for charge pump clock generation in order to suppress EMI noise due to high write throughput of code flash macros, and peak power of EMI noise is reduced by 19 dB.
机译:已开发出首个28 nm嵌入式分裂门MONOS(SG-MONOS)闪存宏,以增加微控制器单元中嵌入的存储容量,并提高结点温度范围(从170到170)的性能,这在汽车领域是非常需要的。人们已经对可靠性特性的下降以及工艺收缩引起了极大的关注。温度调节字线过载机制将随机读取访问频率提高了15%,并通过200 MHz的代码闪存宏无等待随机访问实现了6.4 GB / s的读取吞吐量,并使WL驱动程序的TDDB寿命延长了十倍以上。温度自适应步进脉冲擦除控制(TASPEC)将金属互连层之间的介电膜的TDDB寿命提高了三倍。 TASPEC对于具有一百万个重写周期的数据闪存宏特别有用。具有负反向偏置电压的源极侧注入(SSI)程序可将程序脉冲时间减少63%,因此,实现代码闪存宏的2.0 MB / s写入吞吐量。为了抑制由于代码闪存宏的高写入吞吐量而引起的EMI噪声,引入了扩频时钟生成和时钟相移技术以实现电荷泵时钟生成,并将EMI噪声的峰值功率降低了19 dB。

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