机译:40- <公式Formulatype =“ inline”>
Department of Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California, Irvine, CA, USA;
Bonding; Gold; Joints; Resists; Silicon; Strain; Substrates; Copper; electronic packaging; flip-chip interconnect; fluxless bonding; gold; interconnect; solid-state bonding;
机译:迈向微观飞行:300次
机译:Ba <分子式
机译:Sm的磁致伸缩<分子式
机译:紧凑的6 ns传播延迟200 Mbps
机译:A 265 V <公式甲型键=“内联”>