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Low ohmic-contact resistance in recessed-gate normally-off AlGaN/GaN MIS-HEMT with δ-doped GaN Cap Layer

机译:具有δ掺杂GaN盖层的凹栅常关AlGaN / GaN MIS-HEMT中的低欧姆接触电阻

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In this paper, we discuss an ohmic contact resistance (R) in a recessed-gate normally-off AlGaN/GaN MIS-HEMT with a δ-doped GaN Cap Layer. This structure ensures high uniformity of a threshold voltage (V) by a selective dry-etching of GaN over AlGaN at a gate region. At the δ-doped region of the GaN cap layer, diffusion of electrons toward the surface leaves excess ionized donors, resulting in compensation of negative polarization charges between the GaN cap and the AlGaN barrier. Thanks to this effect, we successfully obtained an low R of less than 0.1 Ωmm by reduction of band-barrier at the interface between the GaN cap and the AlGaN barrier.
机译:在本文中,我们讨论了具有δ掺杂GaN盖层的凹栅常关AlGaN / GaN MIS-HEMT中的欧姆接触电阻(R)。这种结构通过在栅极区域的AlGaN上方对GaN进行选择性干法蚀刻来确保阈值电压(V)的高度均匀性。在GaN盖层的δ掺杂区域,电子向表面的扩散会留下过量的电离施主,从而补偿了GaN盖和AlGaN势垒之间的负极化电荷。由于这种效应,我们通过减小GaN盖和AlGaN势垒之间的界面的能带垒成功地获得了小于0.1Ωmm的低R。

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