Flip chip technology and its application in microwave module

摘要

Stud bump bonding technology is suitable for various microwave modules, since it gives bumps on many different kinds of IC chips with the advantage of simple technique, low cost and needing no UBM. Stud bump flip chip technology and its application in microwave module was introduced in the paper, preparation of stub bump and flip chip process were studied in detail. The results indicate that US power, bonding force and bonding time are the key parameters which influence the stub bump bonding process and stub bump quality. The optimal process parameters are US time about 50ms, US power about 0.36W and bonding force about 55gf, which is obtained by experiments. A kind of microwave chip was fliped on multi-layer thin-film substrate using stud bump flip chip technology, which indicated that stud bump flip chip technology is suitable for hybrid integrated circuit MMIC bonding in small batch. Stud bump flip chip can meet the needs of study and production of microwave modules.