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Galvanic plating for 3D-MID applications

机译:用于3D-MID应用的电镀

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摘要

This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.
机译:本文概述了3D-MID电镀镀层的优势。首先说明激光直接成型过程是如何进行的。在摩托车的串行应用示例中,它在第一部分中显示了在串行过程中化学标准镀层所面临的挑战。第二部分说明电镀过程和化学沉淀过程在电镀过程中的差异。提到了用于进一步开发的应用的主要涂层厚度的优点。还给出了在电镀过程的开发中需要考虑的具体细节。

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